Deformation structures and textures in cold-rolled 70:30 brass

Duggan, B.J.; Hatherly, M.; Hutchinson, W. B.; Wakefield, P. T.

doi:10.1179/030634578790433909

Cited by 231 publications

(122 citation statements)

References 21 publications

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“…15. It is found that most misorientation angles of the neighboring subgrains/crystallites are increased from [1][2][3][4][5][6][7][8][9][10] (at " ¼ 4600%, Fig. 15(a)) to 10-25 (" ¼ 30000%, Fig.…”

Section: )mentioning

confidence: 99%

“…Such a simple processing route is usually not ideal for producing nanostructures in metals. Cold rolling of Cu at RT has been studied extensively before, [7][8][9][10][11][12][13][14][15][16][17][18][19] with thickness reduction typically in the range of 0-15,000% (Von Mises equivalent strain ¼ 0-5). At medium to high plastic strains (1 < < 5), it is generally understood that multiple dislocations interact, forming multifarious defects such as dislocation cells, cell blocks, microbands, twins and subgrains.…”

Section: Introductionmentioning

confidence: 99%

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Dynamic Processes for Nanostructure Development in Cu after Severe Cryogenic Rolling Deformation

Wang

Jiao

2003

Mater. Trans.

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The dynamic grain refinement behavior upon severe plastic deformation has been systematically studied in commercial purity copper that was heavily cold rolled to large deformations at cryogenic temperatures. The low-temperature rolling allows the accumulation of extraordinarily high densities of dislocations in Cu, enabling an investigation of the various dynamic recrystallization phenomena upon further deformation. The eventual steady-state grain sizes achieved, as well as the dynamic recrystallization mechanisms, are studied using controlled deformation tests combined with transmission electron microscopy. The dominant mechanisms observed to contribute to grain refinement in Cu include the classical migration dynamic recrystallization process, the deformation twinning, as well as the continuous dynamic recrystallization via progressive lattice rotation upon deformation to extremely large strains. The strain rate and deformation temperature have strong effects on the operative mechanisms and the grain sizes achieved in the ultrafine and nanocrystalline regimes.

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Section: )mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Dynamic Processes for Nanostructure Development in Cu after Severe Cryogenic Rolling Deformation

Wang

Jiao

2003

Mater. Trans.

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“…Nevertheless, both the simulated and the measured texture evolutions in the Cu phase of the composite are pronounced different from the copper-type textures expected for rolled pure metals with medium or high SFEs. 14,16,33,37) Thus, it is obvious that the existence of the Ag phase or Cu-Ag heterointerface plays an important role for the texture evolution of the Cu phase when the phase is embedded into a composite. In this work, quantitative influence of microstructures on the micromechanisms as well as deformation textures in a Cu-Ag composite is studied by both experiments and numerical modeling.…”

Section: Discussionmentioning

confidence: 99%

“…14,15) For fcc materials with medium or high SFE (such as Cu and Al), dislocation glide is the main mechanism during cold rolling and the Copper (ð112Þ½11 1) and S ((1 2 3) [6 3 4]) texture components (copper-type textures) are developed. 16,17) In contrast, for metals with low SFE (such as Ag, ¡-brass and austenitic steels) at large deformations, mechanical twinning and shear banding are the main mechanisms. Accordingly, the Brass ((0 1 1)[2 1 1]) and Goss ((0 1 1)[1 0 0]) components (brass-type texture) are the main rolling textures, as verified by local orientation measurements 18,19) and finite element modeling.…”

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confidence: 99%

Inhomogeneous Texture Distribution in a Cu-Ag Lamellar Composite Processed by Cold Rolling

et al. 2016

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The inhomogeneous texture distribution in a lamellar composite incorporating two dissimilar face-center-cubic metals, i.e., Cu and Ag, under cold rolling is investigated. When the thickness reduction is higher than 80%, the heterogeneity of textures is found in the Cu layer. Namely, in the region adjacent to the rollers the Copper component dominates over the other textures, whereas in the region closed to the heterointerface the Brass component is the dominant texture. Lattice rotations within the heterophase microstructure are then addressed by crystal plasticity finite element modeling that considers not only crystallographic (dislocation slip and twinning) but also non-crystallographic (shear banding) micromechanisms. The simulations show that the hetero-interface between the Cu and Ag layers plays an important role in texture development of the Cu layer when the two metals are co-deformed. In the Cu phase of the studied composite, significant shear banding is triggered by stress concentration at the hetero-interface compared to the positions away from the interface, which leads to the dominant Brass texture in the interface region.

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“…[6,[11][12][13] In FCC materials, it is known that SFE can affect the deformation mechanisms significantly. [14][15][16] When the SFE is high, dislocation slip in the wavy mode dominates the plastic deformation. [17] In contrast, when the SFE is low, dislocation slip in the planar mode dominates and dislocation recovery will be inhibited; besides, stacking faults (SFs) and deformation twins (DTs) prevail.…”

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confidence: 99%