Degradation kinetics of Ti-Cu compound layer in transient liquid phase bonded graphite/copper joints

Lin, Jincheng; Huang, Mengxing; Yang, Weiqi; Xing, Lili

doi:10.1038/s41598-018-33446-3

Cited by 8 publications

(4 citation statements)

References 26 publications

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“…For the light-gray micro-region B, the atomic ratio of Ti/Cu is about 1:4, corresponding to TiCu4. Lin et al [8] also detected TiCu4 phase in the bonding area for the graphite/Cu joint bonded with Ti foil at 920 o C. Similarly, the dark-gray micro-region D and gray micro-region E in the particle-like region provide Ti/Cu atomic ratio of 2:1 and 1:1 respectively, determined as Ti2Cu and TiCu, respectively. The micro-region F adjacent to the graphite substrate consists of 12.84 at.% C, 69.56 at.% Ti and 17.60 at.% Cu, deduced as a mixture of TiC and Ti-Cu.…”

Section: Microstructure Of Joint With Ti/cu/ti Multi-foilsmentioning

confidence: 92%

“…Furthermore, transient liquid phase bonding (TLPB), based on formation of liquid phase by the eutectic reaction between metal foils or between metal foil and metal substrate, is an alternative technique for joining dissimilar materials [7]. Ti metal foil has been used to create a good bond between graphite and Cu by TLPB due to the formation of a eutectic phase between the Ti foil and Cu substrate [8].…”

Section: Introductionmentioning

confidence: 99%

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Bonding of graphite to Cu with metal multi-foils

Cai

et al. 2023

Archiv.Civ.Mech.Eng

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Graphite/Cu bonding is essential for the fabrication of graphite-based plasma-facing parts and graphite-type commutators. Transient liquid phase bonding of graphite/Cu has been conducted separately with Ti/Cu/Ti and Ti/Cu/Ni/Ti multi-foils. The interfacial microstructure and mechanical properties of the bonded joints have been characterized. For the joint with Ti/Cu/Ti multi-foils, complete melting of the Ti/Cu/Ti multi-foils and interdiffusion between the molten zone and the Cu substrate occur during the bonding process, leading to formation of Ti-Cu intermetallics in the bonding area. The liquid phase flowing towards sidewall of the Cu substrate gives rise to a thickness of the bonding area far less than those of the as-received multi-foils. For the joint with Ti/Cu/Ni/Ti multi-foils, the bonding area can be divided into three parts (areas I, II and III). The bonding areas I and III are comprised of Ti-Cu intermetallics and Ti(CuxNi1-x)2, while the bonding area II consists of a Ni layer and two thin TiNi3 reaction layers. The thickness of the whole bonding area is similar to those of the as-received multi-foils, indicating that addition of Ni foil can prevent the loss of liquid phase zone by inhibiting the excessive liquid phase formation. The addition of a Ni foil in bonding of the graphite/Cu may alleviate the joint residual stress by its intermediate coefficient of thermal expansion (CTE) to accommodate any thermal mismatch in the joint and by its superior ductility and plasticity, thus resulting in shear strength promotion of the joint with the Ti/Cu/Ni/Ti multi-foils by approximately 35% when compared to the Ti/Cu/Ti multi-foils.

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Section: Microstructure Of Joint With Ti/cu/ti Multi-foilsmentioning

confidence: 92%

Section: Introductionmentioning

confidence: 99%

Bonding of graphite to Cu with metal multi-foils

Cai

et al. 2023

Archiv.Civ.Mech.Eng

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“…The reason can be due to the highest melting point of Ti among all the constituents. This is because elements with a low melting point have a higher diffusion coefficient in the solid-state [25][26][27]. It is, therefore, judged that the order of alloying of the constituent elements is related to the melting point of the constituent elements.…”

Section: Phase Evolution Of Powder and Bulk Lwheamentioning

confidence: 99%

Lightweight AlCuFeMnMgTi High Entropy Alloy with High Strength-to-Density Ratio Processed by Powder Metallurgy

Chae

Sharma

et al. 2020

Met. Mater. Int.

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In this study, we synthesized a new Al 16.6 Cu 16.6 Fe 16.6 Mn 16.6 Mg 16.6 Ti 16.6 lightweight high entropy alloy (LWHEA) by high energy ball milling and spark plasma sintering (SPS). The effect of milling time (15, 30, 45, and 60 h) and SPS conditions (600 and 700 °C) on microstructure, hardness, and density of LWHEAs were studied. The results showed that milled LWHEA is base centered cubic (BCC) structured, consisting of dual BCC1/BCC2 matrix with dispersed minor Cu 2 Mg precipitates and Ti. After SPS of milled samples, the BCC2 phase fraction was increased gradually. The distribution of Ti was uniform up to 45 h milled sample SPSed at 600 °C. However, porosity was built up beyond 45 h milling and higher SPS temperature (700 °C). The presence of finer secondary phases in the HEA matrix contributes to the dispersion hardening. The optimum microhardness and density of LWHEA AlCuFeMnMgTi were around 770 HV and 4.34 g cm − 3 which is superior to other conventional alloys such as Al or Ti-based alloys.

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“…However, graphite/Mo TLPB has not been reported so far and only limited references focus on graphite/metal (excluding Mo) TLPB. Lin et al [5] applied Ti foil in graphite/Cu TLPB at 920°C. The shear strength of joint obtained by TLPB showed 20.8% higher than that by brazing.…”

Section: Introductionmentioning

confidence: 99%

Joining of graphite to Mo using Ti/Cu and Ti/Cu/Nb/Ti/Cu foils

Xu,

Huang,

Jiang

et al. 2023

Science and Technology of Welding and Joining

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Graphite/Mo joining has been carried out using Ti/Cu or Ti/Cu/Nb/Ti/Cu foils. The joining region in the joint using Ti/Cu foils is mainly composed of Ti 3 Cu 4 and TiCu. The joining region using Ti/Cu/Nb/Ti/Cu foils contains a joining zone I, an Nb interlayer and a joining zone II. Both the joining zones I and II are made up of Ti 3 Cu 4 and TiCu. The Nb foil diffuses and dissolves into the liquid fillers during the bonding. The joint using Ti/Cu/Nb/Ti/Cu foils shows higher shear strength than that using Ti/Cu foils, implying the contribution of Nb foil to the joint stress relief and to the joint strength promotion.

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Degradation kinetics of Ti-Cu compound layer in transient liquid phase bonded graphite/copper joints

Cited by 8 publications

References 26 publications

Bonding of graphite to Cu with metal multi-foils

Bonding of graphite to Cu with metal multi-foils

Lightweight AlCuFeMnMgTi High Entropy Alloy with High Strength-to-Density Ratio Processed by Powder Metallurgy

Joining of graphite to Mo using Ti/Cu and Ti/Cu/Nb/Ti/Cu foils

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