Degradation of adhesion between Cu and epoxy-based dielectric during exposure to hot humid environments

Ahn, Key one; Park, Se Hoon; Kim, Young-Ho

doi:10.1016/j.microrel.2017.07.083

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Degradation of adhesion between Cu and epoxy-based dielectric during exposure to hot humid environments

Cited by 5 publications

References 35 publications

Degradation Mechanism of Interfacial Adhesion between Screen-Printed Ag/Polyimide in Temperature/Humidity Environment

Degradation Mechanism of Interfacial Adhesion between Screen-Printed Ag/Polyimide in Temperature/Humidity Environment

Enhanced adhesion strength of copper deposited epoxy composite films for chip substrates by tuning copper oxide and internal stress

Development and Characterization of Epoxy Molding Compound with High Glass Transition Temperature

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