Degradation testing and failure analysis of DC film capacitors under high humidity conditions

Wang, Huai; Nielsen, Dennis; Blaabjerg, Frede

doi:10.1016/j.microrel.2015.06.011

Cited by 48 publications

(11 citation statements)

References 8 publications

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“…40 shows the V RGext peak detector output on an Infineon FF200R12PT4 under different temperatures. From the peak of V RGext , R G int can be calculated based on (14) and the assumptions mentioned above:…”

Section: ) Junction Temperature Estimation Methods By Internalmentioning

confidence: 99%

“…Therefore, recent research endeavors to improve the reliability of PESs to comply with more stringent constraints on cost, safety, and availability in various applications. Especially, the reliability assessment and lifetime prediction of reliability critical components such as power device modules and capacitors in PESs are the major concern [8]- [14].…”

Section: Introductionmentioning

confidence: 99%

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Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress

Choi

Blaabjerg

Jørgensen

2018

IEEE Trans. Power Electron.

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183

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Power cycling test is one of the important tasks to investigate the reliability performance of power device modules in respect to temperature stress. From this, it is able to predict the lifetime of a component in power converters. In this paper, representative power cycling test circuits, measurement circuits of wear-out failure indicators as well as measurement strategies for different power cycling test circuits are discussed in order to provide the current state of knowledge of this topic by organizing and evaluating current literature. In the first section of this paper, the structure of a conventional power device module and its related wear-out failure mechanisms with degradation indicators are discussed. Then, representative power cycling test circuits are introduced. Furthermore, on-state collector-emitter voltage (V C E O N ) and forward voltage (V F ) measurement circuits for wear-out condition monitoring of power device modules during power cycling test are presented. Finally, different junction temperature measurement strategies for monitoring of solder joint degradation are explained.Index Terms-Failure mechanism, insulated gate bipolar transistor (IGBT), power cycling (PC) test, power device module, reliability, wear-out failure.

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Section: ) Junction Temperature Estimation Methods By Internalmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress

Choi

Blaabjerg

Jørgensen

2018

IEEE Trans. Power Electron.

Self Cite

183

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“…Regarding the aging of DC capacitors, the capacitance attenuation and ESR growth characteristics of the metallized DC film capacitor were fitted under the joint influence of the ripple voltage, high-temperature (85 ℃), and varying humidity. The analysis revealed differences in performance at different humidity levels under high-temperature conditions [11] . Studies on the aging mechanism of thin-film capacitors initially focused on voltage and temperature, yielding significant accomplishments.…”

Section: Confronted With the High Temperatures And Humiditymentioning

confidence: 99%

Aging Mechanism and Life Estimation of Photovoltaic Inverter DC-link Capacitors in Alternating Humid and Thermal Environment

Gao,

Li,

Cui

et al. 2024

Chin. J. Electr. Eng.

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DC-link capacitors play a vital role in managing ripple voltage and current in converters and various devices. This study focuses on exploring the aging characteristics of DC-link capacitors in alternating humid and thermal environments aligned with the operational conditions in photovoltaic and wind power applications. Adhering to relevant power equipment standards, we designed a 24-h alternating humid and thermal aging environment tailored to the requirements of DC-link capacitors. An aging test platform is established, and 20 widely used metallized polypropylene film capacitors are selected for evaluation. Parameters such as the capacitance, equivalent series resistance (ESR), and phase angle are assessed during aging, as well as the onset time and extent of aging at various intervals. This study focuses on the aging mechanisms, analyzing electrode corrosion, the self-healing process, and dielectric aging. Fitting the aging characteristics enabled us to calculate the lifespan of the capacitor and predict it under different degrees of capacitance decay. The results show that under alternating humid and thermal conditions, capacitance attenuation and ESR increase exhibit exponential nonlinearity, influenced by factors such as the oxidation and self-healing of capacitive metal electrodes, dielectric main-chain fracture, and crystal transformation. This study underscores the pivotal role of encapsulation in determining the aging decay time.

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“…These examples represent two large databases for converterspecific failure analyses, which are rarely made publicly available in other power electronic applications. Both findings suggest the need for further investigation of humidity-related failure mechanisms for power electronic components [21,22]. Nevertheless, they do not necessarily imply that the thermalrelated wear-out failure mechanisms are irrelevant.…”

Section: A Examples Of Field Experiencesmentioning

confidence: 99%

Power Electronics Reliability: State of the Art and Outlook

Wang

Blaabjerg

2021

IEEE J. Emerg. Sel. Topics Power Electron.

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Degradation testing and failure analysis of DC film capacitors under high humidity conditions

Cited by 48 publications

References 8 publications

Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress

Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress

Aging Mechanism and Life Estimation of Photovoltaic Inverter DC-link Capacitors in Alternating Humid and Thermal Environment

Power Electronics Reliability: State of the Art and Outlook

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