Demand and Challenges for Wafer-Level Chip-Scale Analog and Power Packaging

Qu, Shichun; Liu, Yong

doi:10.1007/978-1-4939-1556-9_1

Cited by 1 publication

(3 citation statements)

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“…Microelectronic packaging represents an important step during the fabrication of microelectronic devices because it provides the electrical connection/isolation, mechanical support, thermal cooling, and physical protection of the electronic components. Therefore, the performance of a power module depends also on the electrical, thermal, and mechanical properties of the packaging materials. , …”

Section: Introductionmentioning

confidence: 99%

“…Therefore, the performance of a power module depends also on the electrical, thermal, and mechanical properties of the packaging materials. 5 , 6 …”

Section: Introductionmentioning

confidence: 99%

“…Therefore, the performance of a power module depends also on the electrical, thermal, and mechanical properties of the packaging materials. 5,6 Dielectric polymers have widely been employed in the fabrication of microelectronic devices, such as buffer coatings, passivation layers, alpha particle barriers, and re-distribution layers in wafer-level packaging. In fact, they show suitable features such as low dielectric constant, high mechanical toughness, high thermal conductivity and stability, low moisture absorption, good adhesion to substrates, and chemical inertness.…”

Section: ■ Introductionmentioning

confidence: 99%

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Chemical and Morphological Modifications Induced by Argon Plasma Treatments on Fluorinated Polybenzoxazole Films

et al. 2023

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Fluorinated photodefinable polymers are widely employed as re-distribution layers in wafer-level packaging to produce microelectronic devices because of their suitable low dielectric constant and moisture absorption, high mechanical toughness, thermal conductivity and stability, and chemical inertness. Typically, fluorinated photodefinable polybenzoxazoles (F-PBOs) are the most used in this field. In the present work, we investigated by atomic force microscopy, X-ray photoelectron spectroscopy, and Fourier transform infrared spectroscopy the morphological and chemical modifications induced by Ar plasma treatments on F-PBO films. This process, used to remove surface contaminant species, as well as increase the polymeric surface roughness, to improve the adhesion to the other components during electronic packaging, is a crucial step during the manufacturing of some microelectronic devices. We found that argon plasma treatments determine the wanted drastic increase of the polymer surface roughness but, in the presence of a patterned silver layer on F-PBO, needed for the fabrication of electric contacts in microelectronic devices, also induce some unwanted formation of silver fluoride species.

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Section: Introductionmentioning

confidence: 99%

“…Therefore, the performance of a power module depends also on the electrical, thermal, and mechanical properties of the packaging materials. 5 , 6 …”

Section: Introductionmentioning

confidence: 99%

Section: ■ Introductionmentioning

confidence: 99%

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