Demonstration of a Hybrid Opto-Electronic Transmitter on SoI for Access Networks

Abstract

We present a hybrid integrated transmitter comprised of an InP/InGaAsP electro-absorption modulated laser (EML) electrically driven by a BiCMOS SiGe electronic circuit on 4-µm SoI substrate. The EML includes an electro-absorption modulator integrated together with a distributed feedback laser and a spot-size expander. The modulator driver is fabricated using the SiGe BiCMOS approach with 2.5 V p-p nominal output swing. Both elements have been flip-chip mounted on a thick SoI board using 14-µm gold-tin bumps and employing a high accuracy flip-chip bonder. The photonic chip has a footprint of 7 mm 2 and consumes a power of 0.8 W. We test the device optically and electrically demonstrating error-free operation at 10 and 20 Gb/s. Index Terms-Hybrid photonic integration, silicon-oninsulator, opto-electronic devices, optical access, fiber to the home (FTTH).