“…A machining tolerance with a few microns, a surface roughness with hundreds of nanometers and a small assembling error are typically required in the fabrication of the HFS in a terahertz band SB-TWT. Considerable efforts have been made for the fabrication of the micro-structures in a terahertz vacuum electron device, such as the nano-computer numerical control (CNC) milling techniques [3], [15], [24]- [25], LIGA (German acronym for lithography, electroplating, and molding) process techniques [13], [26], deep-reactive ion etching (DRIE) techniques [26], wire cutting techniques [10], [27], and the 3D-printed mold electroforming [28].…”