Demonstration of Low Temperature Cu-Cu Hybrid Bonding using A Novel Thin Polymer

Kayaba, Yasuhisa; Shikama, Takuo; Okada, Wataru; Tamura, Kahori; Nakamura, Yuzo; Hisamune, Yutaka; Furusho, Rikia

doi:10.1109/ectc51529.2024.00101

2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024

DOI: 10.1109/ectc51529.2024.00101

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Demonstration of Low Temperature Cu-Cu Hybrid Bonding using A Novel Thin Polymer

Yasuhisa Kayaba,

Takuo Shikama,

Wataru Okada

et al.

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Demonstration of Low Temperature Cu-Cu Hybrid Bonding using A Novel Thin Polymer

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References 15 publications

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