“…The constraint of only growing a derivative oxide layer of the underlying polycrystalline metal can be resolved by directly depositing an insulator on the bottom metal electrode using different deposition techniques and thus facilitating the use of any type of bottom metal electrode irrespective of its native oxide formation properties. These deposition techniques include sputtering [14,17,20,27,28,45,51,59,74,80,83,90,97,98], electron beam evaporation [88] and atomic layer deposition [8,9,18,30,51,56,58,75,81,89,96,[99][100][101], as listed in Tables 2 and 3. Among these techniques, ALD offers the best quality oxides with low defect density, excellent conformality and uniformity.…”