2020
DOI: 10.1016/j.ensm.2019.06.010
|View full text |Cite
|
Sign up to set email alerts
|

Dendrite-free lithium deposition by coating a lithiophilic heterogeneous metal layer on lithium metal anode

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

2
93
0
1

Year Published

2020
2020
2021
2021

Publication Types

Select...
7
1

Relationship

0
8

Authors

Journals

citations
Cited by 161 publications
(97 citation statements)
references
References 43 publications
2
93
0
1
Order By: Relevance
“…The other peaks were attributed to the lattice planes of (200) and (220) of the Cu substrate. X‐ray photoelectron spectroscopy (XPS) pattern is given in Figure g, two peaks at 373.6 and 367.9 eV were attributed to the binding energies of Ag 3d3/2 and Ag 3d5/2, respectively, and the distance between these two peaks was about 5.7 eV, indicating the existence of metallic Ag . The other peaks at 952.0 and 932.1 eV were associated with the binding energies of Cu 2p1/2 and Cu 2p3/2, respectively.…”
Section: Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…The other peaks were attributed to the lattice planes of (200) and (220) of the Cu substrate. X‐ray photoelectron spectroscopy (XPS) pattern is given in Figure g, two peaks at 373.6 and 367.9 eV were attributed to the binding energies of Ag 3d3/2 and Ag 3d5/2, respectively, and the distance between these two peaks was about 5.7 eV, indicating the existence of metallic Ag . The other peaks at 952.0 and 932.1 eV were associated with the binding energies of Cu 2p1/2 and Cu 2p3/2, respectively.…”
Section: Resultsmentioning
confidence: 99%
“…Herein, we developed a simple and commercially viable strategy for large‐scale preparation of modified Cu foil with Ag nanoparticles by a green and simple substitution reaction between pure Cu and Ag + . These Ag nanoparticles were uniformly anchored on planar Cu substrate (labeled as Cu‐Ag), which can not only homogenize the electric field and ion distribution on the surface but also be used as the Li metal seeds for inducing the Li deposition due to the prominent affinity of Ag for Li, realizing evenly Li plating . Consequently, even at a very high lithium capacity of 5.0 mAh cm −2 , the Cu‐Ag collector could still ensure the uniform plating morphology.…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, researchers have also developed various kinds of lithium-containing alloys artificial protective layers. The protective lithium alloy layers are generally thin films formed on the Li metal surface via chemical/electrochemical pre-treatment [85,[109][110][111][112][113][114][115][116][117][118][119][120], mechanical press [121,122], magnetron sputtering [60], etc., which are acceptable ionic conductivity for Li migration as well as suppress the dendrite growth via homogenous deposition of lithium [32]. For example, Li group reported a magnetron sputtering method to deposit a thin Al film on lithium surface [60].…”
Section: Artificial Protective Layers For Lithium Alloys Anodesmentioning
confidence: 99%
“…Accompanying this electrodeposition process, some dendrites will be produced at the edge of the cathode plate, and they give rise to relatively low current efficiency in the electrolytic process . Various strategies have been developed to mitigate the negative impact of dendrites . For instance, Wang and co‐workers demonstrated the vital effect of plating residual stress on Li dendrite growth through depositing Li on the surface of 2D wrinkled copper .…”
Section: Introductionmentioning
confidence: 99%
“…5,6 Various strategies have been developed to mitigate the negative impact of dendrites. [7][8][9][10][11] For instance, Wang and co-workers demonstrated the vital effect of plating residual stress on Li dendrite growth through depositing Li on the surface of 2D wrinkled copper. 12 Lu et al reported that the CNT framework as the host material could afford lower Zn nucleation overpotential and homogeneous electric field distributions to prevent the formation of Zn dendrite.…”
Section: Introductionmentioning
confidence: 99%