Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials

Barako, Michael T.; Isaacson, Scott G.; Lian, Feifei; Pop, Eric; Dauskardt, Reinhold H.; Goodson, Kenneth E.; Tice, Jesse

doi:10.1021/acsami.7b12313

Cited by 59 publications

(39 citation statements)

References 39 publications

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“…To analyze and predict the pressure‐dependent thermal characteristics of BPCu/PDMS IPCs, pressure‐inverse functional form was adopted, and the relation between measured R ″ total and applied pressure could be expressed as: R ″ total = CP –1 + Y , where C represents the fitting parameter, P was the applied pressure, and Y was the equation offset in the y ‐direction . [ 24 ]…”

Section: Methodsmentioning

confidence: 99%

“…The use of continuous monolithic structure minimizes filler‐filler contact resistances, enabling a higher thermal conductivity. [ 23–25 ] The monolithic structures are often fabricated by backfilling the vacancies of a sacrificial template with a desired structural material, the structure with inverse‐morphology of the template is then formed. After the formation of the structural material, sacrificial templates are then typically etched or dissolved by using suitable chemistry.…”

Section: Introductionmentioning

confidence: 99%

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Mechanically Compliant Thermal Interfaces Using Biporous Copper‐Polydimethylsiloxane Interpenetrating Phase Composite

Lin

Izard

Valdevit

et al. 2020

Adv Materials Inter

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Thermal interface materials are essential for thermal management in electronics packaging by providing a low resistance thermal pathway between heat sources and heat sinks. Nanostructured materials can be potential candidates for the next‐generation interface materials by coupling their high thermal conductivity and mechanical compliance, suppressing failure even after large numbers of thermal cycles. This work investigates the thermal and mechanical characteristics of a new type of thermal interface materials, consisting of metal/elastomer interpenetrating phase composites. The 3D, highly porous copper scaffolds are fabricated via a fast and simple in situ bubble‐templated electrodeposition process without the presence of solid templates; subsequently, the void fraction of the composite is filled by elastomer infiltration. The presence of elastomer matrix demonstrates limited impact on the thermal conductivity of the composite while it contributes substantially to the mechanical properties, providing the structural flexibility required. Thermal resistance values of 1.2–4.0 cm2 K W–1 are measured upon multiple thermal cycles, confirming the mechanical stability of the composite, without showing any noticeable degradation.

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Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Mechanically Compliant Thermal Interfaces Using Biporous Copper‐Polydimethylsiloxane Interpenetrating Phase Composite

Lin

Izard

Valdevit

et al. 2020

Adv Materials Inter

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“…One possibility is to enhance the intrinsic thermal conductivity of the polymers by the alignment of the polymer chains [4][5][6][7], but the high cost and complicated process are two major barriers for the large-scale application of this method. Besides engineering the structure and morphology of the polymer itself, another effective approach to enhance the thermal conductivity of the material is to incorporate into the polymer matrix a proportion of thermally conductive fillers, such as metals [8][9][10], ceramics [11,12], carbonbased materials [13] and their hybrids [14,15].…”

Section: Introductionmentioning

confidence: 99%

Epoxy composites filled with boron nitride: cure kinetics and the effect of particle shape on the thermal conductivity

Moradi

Calventus

Román

et al. 2020

J Therm Anal Calorim

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Thermally conducting and electrically insulating materials have been prepared by filling an epoxy-thiol system with boron nitride (BN) particles of different shapes (platelets and agglomerates) and sizes (from 2 to 180 μm), and hence with different specific surface areas. The cure kinetics has been studied by differential scanning calorimetry in both non-isothermal and isothermal modes, and it has been shown that there is a systematic dependence of the cure kinetics on the BN content, the cure reaction generally being retarded by the addition of the BN particles. For filler loadings greater than about 30 vol%, the retardation of the cure, in both isothermal and non-isothermal mode, appears also to decrease as the specific surface area decreases. For the smallest (2 μm) platelets, which have a significantly higher specific surface area (10 m 2 g −1), the retardation is particularly pronounced, and this aspect is rationalized in terms of the activation energy and frequency factor of the reaction. The thermal conductivity of the cured epoxy-thiol-BN composites has been measured using the transient hot bridge method and is found to increase in the usual way with increasing BN content for all the particle types and sizes. For the platelets, the thermal conductivity increases with increasing particle size, mirroring the effect of BN content on the cure kinetics. The agglomerates, though, give the highest values of thermal conductivity, contrary to what might be expected in the light of their specific surface areas. Scanning electron microscopy of the fracture surfaces of the cured composites has been used to show that the interface between epoxy matrix and filler particles is better for the agglomerates. This, together with the reduced interfacial area, explains their higher thermal conductivity.

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“…Wang et al reduced TCR using a TIM that synthesized aligned carbon nanotubes 9 (CNTs) on both sides of a thin copper foil. It has been reported that the [10][11][12] TCR is reduced by filling the TIM between the solid-solid interfaces. The heat transfer capacity between the rough solid-solid interface can be represented by the total TCR, which is mainly composed of two part: [13][14][15] (1) the bulk resistance(R ), (2) the boundary resistance(R ).…”

Section: Introductionmentioning

confidence: 99%

Enhanced Thermal Transport Properties of Epoxy Resin Thermal Interface Materials

Li¹,

Zhang²,

He³

et al. 2019

ES Energy Environ.

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In this work, multilayer graphene (MLG), graphene oxide (GO) and carbon nanotube (CNT) are studied as fillers in epoxy resin to enhance thermal transport properties of polymer thermal interface material (TIM). The MLG/CNT filler significantly enhances the thermal conductivity of the epoxy matrix material, increasing thermal conductivity by about 553% at 25 wt% load. At the same time, theoretical models are used to predict the thermal conductivity of TIM, and the model predictions are in a reasonable agreement with the experimental values. We also analyzed the thermal contact resistance (TCR) at the interface between the experimentally obtained TIM and solid in detail. The TCR measured at a pressure of 0.75 MPa is 42.8 mm •K/W, which was reduced by a factor of 86.7 % compared to the absence of TIMs 2 (The TCR without adding any thermal interface material is 321.8mm •K/W). It is also established that although MLG contributes more to the 2 thermal conductivity of epoxy resin than GO, GO/epoxy composites are superior to MLG/epoxy composites in reducing the total TCR of solid-solid interface. Our results provide a guideline to enhance thermal transport properties of epoxy resin-based carbon nanocomposites as thermal interface materials (TIMs) for various thermal management applications.

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Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials

Cited by 59 publications

References 39 publications

Mechanically Compliant Thermal Interfaces Using Biporous Copper‐Polydimethylsiloxane Interpenetrating Phase Composite

Mechanically Compliant Thermal Interfaces Using Biporous Copper‐Polydimethylsiloxane Interpenetrating Phase Composite

Epoxy composites filled with boron nitride: cure kinetics and the effect of particle shape on the thermal conductivity

Enhanced Thermal Transport Properties of Epoxy Resin Thermal Interface Materials

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