Eutectic AuSn20 solder is an important
material for electronic
packaging technology due to its superior mechanical and thermal conductive
properties. In this work, AuSn20 alloy films are prepared via the
electrodeposition method for the first time. The electrodeposition
is cost-effective with improved control over the alloy content when
compared to traditional powdered metallurgy methods. Pyrophosphoric
acid was found to be an effective complexing agent to minimize the
difference of the deposition potentials between Au and Sn, making
the codeposition of AuSn alloys possible. Importantly, electrochemical
characterization was combined with density functional theory (DFT)
calculations to provide insight into the mechanism of the alloy codeposition
when pyrophosphoric acid was used as the complexing agent. In particular,
natural bond orbital (NBO) charge distribution and the lowest unoccupied
molecular orbital (LUMO) characteristics of [P2O7]4–-Sn(II) and [P2O7]4–-Au(I) complexes are calculated, suggesting that [P2O7]4– is able to coordinate more
strongly with Sn(II) than Au(I). As a result, it can thus shift the
deposition potentials of Au(I) and Sn(II) much closer. As the DFT
predicted, the role of pyrophosphoric acid as a complexing agent has
been experimentally verified, making codeposition of Au and Sn realistic.
The structures of the obtained AuSn20 films are determined using scanning
electron microscopy (SEM) and energy dispersive X-ray spectrometry
(EDX) and found to be consistent with AuSn/Au5Sn eutectic
as predicted by the Au–Sn phase diagram. Additionally, the
measured melting point is in good agreement with the theoretically
determined one. Relevant tests demonstrated in this work indicate
that the newly developed electrodeposited AuSn20 alloy coatings are
suitable for microelectronic soldering applications.