2020
DOI: 10.1134/s0036029520080078
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Density of KF–KCl–KI Melts

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Cited by 9 publications
(7 citation statements)
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“…A mixture of KFHF and KCl powders was placed in a glassy carbon crucible and heated with the stepwise increase in temperature (2 h at 373 K, 3 h at 573 K) for thermal decomposition of KFHF and removal of HF. Then the salts were melted and exposed at 1023 K for 2 h. Potassium iodide was purified from oxygencontaining impurities by heating a mixture of KI with an excess of crystalline iodine in the same way as in: 28 2K2O+2I2=4KI+O2↑.…”
Section: Methodsmentioning
confidence: 99%
“…A mixture of KFHF and KCl powders was placed in a glassy carbon crucible and heated with the stepwise increase in temperature (2 h at 373 K, 3 h at 573 K) for thermal decomposition of KFHF and removal of HF. Then the salts were melted and exposed at 1023 K for 2 h. Potassium iodide was purified from oxygencontaining impurities by heating a mixture of KI with an excess of crystalline iodine in the same way as in: 28 2K2O+2I2=4KI+O2↑.…”
Section: Methodsmentioning
confidence: 99%
“…Electrolytes for silicon electroreduction were prepared in a glassy carbon crucible from commercial chemically pure individual NaI and KI salts (Reakhim, Russia) and commercial reagent grade K2SiF6 (Reakhim, Russia), which was preliminary subjected to hydrofluoration by stepwise heating to 450 °С in the mixture with NH4F [28]. The salt mixture of (wt.%) 56NaI-44KI was purified from oxygen and other admixtures immediately prior to the experiments.…”
Section: Electrolyte Preparationmentioning
confidence: 99%
“…For the KF-KCl-KI system, the eutectic composition with mol%: 25 -KF, 34 -KCl, 41 -KI, having a melting point of 750 K was established by the method of synchronous thermal analysis. 22 The temperature dependences of the densities of melts with mol%: 45 -KF, 55 -KCl, KI and 66.6 -KF, 33.4 -KCl, KI with a KI content from 0 to 100% are described by linear functions in the temperature range of 973-1073 K. 23 An electrolyte close to ours (17% KCl, 8% KF, 75% KI) was used in the electroreduction of silicon on a copper substrate by cyclic voltammetry at 993 K. 24 A uniform distribution of the dopant (p-or n-type) was demonstrated using the co-deposition method. 25 The structure has a great influence on the physical properties of materials.…”
Section: Introductionmentioning
confidence: 99%