Density studies of liquid alloys SnAg and SnZn with near eutectic compositions

Yagodin, D. A.; Сидоров, В. Е.; Janičkovič, D.; Švec, P.

doi:10.1016/j.jnoncrysol.2012.07.001

Cited by 8 publications

(4 citation statements)

References 12 publications

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“…The results of density measurements for Sn-14Zn+In liquid alloys are presented in the form of straight-line temperature dependencies in Table 1 and in Figs. 3 and 4, together with literature data [42][43][44][45]. The density for all compositions decreases with increasing temperature.…”

Section: Densitysupporting

confidence: 56%

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The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system

Pstruś

2017

J min metall B Metall

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The measurements of surface tension, density and viscosity of liquid Sn-Zn eutectic alloys containing 0, 5, 10, 15 and 25 mole fraction of In were carried out using the sessile drop method, dilatometric technique and capillary method. The measurements were performed at temperature range between 493 and 843 K. The technique of sessile drop was applied in the measurements of wetting angles and spreading test in the SnZnIn/ Cu system. Surface tension, density and viscosity measurements were carried out in a protective argon-hydrogen atmosphere. Wettability tests were performed in air in the presence of flux Alu33, at 250°C for 2 minutes. Subsequently, the microstructure of solder and the resulting joints was studied. The addition of In to eutectic Sn-Zn alloy improved the wetting properties and causes a reduction of thickness of the intermetallic compounds layer created at the interface between the liquid solder and the Cu substrate.

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Section: Densitysupporting

confidence: 56%

“…. Pstruś / JMM 53 (3) B (2017) 309 -318 312 Comparison of temperature dependence of density for Sn-Zn eutectic alloy measured in present work by the dilatometric method and those from the literature[42][43][44][45].…”

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confidence: 99%

The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system

Pstruś

2017

J min metall B Metall

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“…19 This resulted in an initial boundary temperature of approximately 1500 K, which is in line with previous studies. [4][5][6][7][8] The variation of thermal properties (density, thermal conductivity and heat capacity) with temperature was handled by fitting literature data [11][12][13][20][21][22][23][24][25][26][27][28] for the properties in the Sn-Zn alloy system. This fit was accomplished using a phenomenological regular solution model that utilized the Redlich-Kister polynomial (Eq.…”

Section: Numerical Modelingmentioning

confidence: 99%

The Effect of Substrate Microstructure on the Heat-Affected Zone Size in Sn-Zn Alloys Due to Adjoining Ni-Al Reactive Multilayer Foil Reaction

Hooper

Adams

Hirschfeld

et al. 2015

Journal of Elec Materi

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The rapid release of energy from reactive multilayer foils can create extreme local temperature gradients near substrate materials. In order to fully exploit the potential of these materials, a better understanding of the interaction between the substrate or filler material and the foil is needed. Specifically, this work investigates how variations in local properties within the substrate (i.e. differences between properties in constituent phases) can affect heat transport into the substrate. This can affect the microstructural evolution observed within the substrate, which may affect the final joint properties. The effect of the initial substrate microstructure on microstructural evolution within the heat-affected zone is evaluated experimentally in two Sn-Zn alloys and numerical techniques are utilized to inform the analysis.

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“…In recent years, Ag-Sn alloys have aroused great scientific research interest because the Ag rich Ag-Sn alloys show excellent electronic conductivity and the Sn-rich Sn-Ag alloys are idea substitutes for lead-free solders [1][2][3][4][5]. Many investigations reveal that the thermodynamic properties of liquid alloys and the final solid microstructures affect their performance [6][7][8][9][10][11][12][13].…”

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confidence: 99%

Thermodynamic properties and microstructural characteristics of binary Ag-Sn alloys

Zhai

Wei

2013

Chin. Sci. Bull.

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The liquidus and solidus temperatures and enthalpy of fusion for Ag-Sn alloys are systematically measured within the whole composition range by differential scanning calorimetry (DSC). The measured enthalpy of fusion is related to Sn content by polynomial functions, which exhibit one maximum value at 52 wt%Sn and two minimum values around 21 wt%Sn and 96.5 wt%Sn, respectively. The liquidus slope, the solidification temperature interval, the solute partition coefficient and the entropy of fusion are calculated on the basis of the measured results. The undercoolability of those liquid Ag-Sn alloys solidifying with primary (Ag) solid solution phase is stronger than the other alloys with the preferential nucleation of  and  intermetallic compounds. Morphological observations reveal that peritectic reactions can rarely be completed, and the peritectic microstructures are always composed of both primary and peritectic phases. Ag-Sn alloy, enthalpy of fusion, undercoolability, peritectic solidification Citation:Zhai W, Wei B B. Thermodynamic properties and microstructural characteristics of binary Ag-Sn alloys. Chin Sci Bull, 2013, 58: 938944,

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Density studies of liquid alloys SnAg and SnZn with near eutectic compositions

Cited by 8 publications

References 12 publications

The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system

The role of physico-chemical properties of liquid solder in reactive wetting: the Cu/SnZnIn system

The Effect of Substrate Microstructure on the Heat-Affected Zone Size in Sn-Zn Alloys Due to Adjoining Ni-Al Reactive Multilayer Foil Reaction

Thermodynamic properties and microstructural characteristics of binary Ag-Sn alloys

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