Dependence of mechanical and thermal deformation behaviors on crystal size and direction of Cu3Sn intermetallic: A molecular dynamics study

Billah, Md. Maruf; Aad, Abdur Rahman; Das, Shimanta; Motalab, Mohammad; Paul, Ratul

doi:10.1016/j.aej.2022.11.025

Cited by 7 publications

(2 citation statements)

References 51 publications

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“…Figure 7 shows the XRD analysis at the cross-section of the solder joint. Cu 6 Sn 5 (6Cu + 5Sn → Cu 6 Sn 5 ) [42] was formed on an IMC layer during thermal shock. During the heat preservation process, the Cu 6 Sn 5 phase gradually grows with the extension of the reaction time.…”

Section: Thermal Shock Analysismentioning

confidence: 99%

“…During the heat preservation process, the Cu 6 Sn 5 phase gradually grows with the extension of the reaction time. The Cu substrate reacts with Cu 6 Sn 5 in the IMC layer to generate Cu 3 Sn (Cu 6 Sn 5 + 9Cu → 5Cu 3 Sn) [42], which is very thin and accounts for a small proportion overall. As the reaction continues, the fusion of Sn and Cu substrates intensifies, and Cu 6 Sn 5 accounts for a much higher proportion in the IMC layer compared to Cu 3 Sn [43].…”

Section: Thermal Shock Analysismentioning

confidence: 99%

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Failure Analysis of Printed Circuit Board Solder Joint under Thermal Shock

Zhou

Chen

et al. 2023

Coatings

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Investigating the failure mechanism of solder joints under different temperature conditions is significant to ensure the service life of a printed circuit board (PCB). In this research, the stress and strain distribution of a PCB solder joint was evaluated by high- and low-temperature thermal shock tests. The cross-section of the solder joint after thermal shock testing was measured using a 3D stereoscopic microscope and SEM equipped with EDS. The microstructure of the lead-free solder joint and the phase of the intermetallic compound (IMC) layer were studied by XRD. The working state of the PCB solder joint under thermal shock was simulated and analyzed by the finite element method. The results show that thermal shock has a great effect on the reliability of solder joints. The location of the actual crack is consistent with the maximum stress–strain concentration area of the simulated solder joint. The brittle Cu6Sn5 and Cu3Sn phases at the interface accelerate the failure of solder joints. Limiting the growth of Cu6Sn5 and Cu3Sn phases can improve the reliability of solder joints to a certain extent.

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Section: Thermal Shock Analysismentioning

confidence: 99%

Section: Thermal Shock Analysismentioning

confidence: 99%