Dependence of shear strength of Sn–3.8Ag–0.7Cu/Co–P solder joints on the P content of Co–P metallization

Liu, Shuang; Hu, Bing; Hu, Yang; Wang, Qian; Li, Liangliang

doi:10.1007/s10854-019-00824-0

Cited by 7 publications

(3 citation statements)

References 34 publications

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“…This yield function is suitable for plane stress condition. Liu et al [2] use the anisotropy yield function and a quasi-flow corner theory to predict the earing, the numerical results agree well with the experimental results of the cylindrical deep drawing. Yang and Hsu [3] used the finite element method to investigate the earing of the deep drawing process.…”

Section: Introductionmentioning

confidence: 60%

Mechanical Properties and Friction of AZ31 Magnesium Alloy and Application to the Cylidrical Deep Drawing Process

Yang

Chen

2017

KEM

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The mechanical properties such as stress-strain curves and anisotropic parameters at different elevated temperatures are obtained by the computerized screw universal testing machine. The friction testing machine is used to determine the friction coefficient between die and AZ31 sheets at different elevated temperatures. The finite element method is used to investigate the earing of the deep drawing process. In order to verify the prediction of FEM simulation of the earing in the cylindrical cup drawing process, the experimental parameters such as stress-strain curves, anisotropic parameters, fiction coefficient and blank holder force, are as the input data during analysis. The experimental cup height compared with the current simulation result of cylindrical deep drawing process at different elevated temperature.

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Section: Introductionmentioning

confidence: 60%

Mechanical Properties and Friction of AZ31 Magnesium Alloy and Application to the Cylidrical Deep Drawing Process

Yang

Chen

2017

KEM

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“…[ 13 ] They also proposed the concept of a self‐driven liquid metal cooling device for thermal chip heat dissipation within a sealed cabinet [ 14 ] and a self‐driven electronic cooling system utilizing the thermosiphon effect of liquid metal at room temperature. [ 15 ] Additionally, an integrated system involving liquid metal droplets, proposed by Khoshmanesh's research group at RMIT University in Australia, employed square wave DC signals to modulate the behavior of liquid metal droplets within cooling pipes. These signals induced surface gradient tension propelling the cooling medium's flow within the pipes.…”

Section: Introductionmentioning

confidence: 99%

Study of an Active Heat‐Dissipating Liquid Metal Wire with Electrical‐Material Cotransmission Characteristics and Its Applications

Wang,

Zhou,

et al. 2024

Adv Eng Mater

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In the field of precision motors, there is a growing demand for higher power density, requiring wires to withstand elevated current density and resulting, in significant heating of the motor. This study investigated various properties of liquid metal conductors and evaluated their potential for enhancing the heat dissipation performance in a motor armature system. The results demonstrate that liquid metal conductors can be successfully applied to a motor armature system. Their characteristics, such as electro‐hydraulic coupling and decoupling, fulfill the requirements of fluid field circulation and unidirectional electrical conduction in the armature system. With a current density of 176.8 mA/cm², the maximum temperature decreased from 35.2 °C to 30.9 °C, achieving a temperature reduction of 12%. This paper details the specific methods for manufacturing motor armatures using liquid metal conductors, including the structures of different types of armature systems. Additionally, the paper also presents a study on some performance aspects of this armature system, showing a decrease in the maximum temperature from 54.9 °C to 50.9 °C, corresponding to a 7.3% temperature reduction. Thus, a novel approach is provided to the thermal management system of motors, which can be further extended to the field of bioelectrodes in future research.This article is protected by copyright. All rights reserved.

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“…Chen et al [ 11 ] investigated the diffusion barrier properties of Sn‐Cu joints by electrodepositing Ni, Co, amorphous Ni–W, and amorphous Co–W on a Cu substrate and found that the amorphous Co–W has the best diffusion barrier properties. Liu et al [ 12 ] found that Co–W alloys have good diffusion barrier performance and explored the possibility of replacing the commonly used Ni barrier layer in electronic packaging. To increase the solder joint quality, the diffusion barrier layer design can also indirectly obtain optimized intermetallic compounds.…”

Section: Introductionmentioning

confidence: 99%

Effect of Different Concentrations of Co Doping on the Properties of η′‐Cu₆Sn₅ and Ni₃Sn₄: First‐Principles Study

Wang,

Huang,

Guo

et al. 2024

Physica Status Solidi (b)

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In the field of electronic packaging, Ni3Sn4‐based and η′‐Cu6Sn5‐based compounds are common Sn‐based intermetallic compounds into which doping of other appropriate elements has been widely studied. Herein, the structural stability, mechanical properties, and electronic structures of (Ni,Co)3Sn4 and η′‐(Cu,Co)6Sn5 are systematically investigated using first‐principles calculations. By comparing the heat of formation of the doped and undoped intermetallic compounds, it is found that the doped Ni3Sn4 structure has a higher heat of formation and a less stable structure, while the doped η′‐Cu6Sn5 structure has a lower heat of formation and a more stable structure. The doped Ni3Sn4 exhibits an increasing bulk modulus (B) and Young's modulus (E), and the doped η′‐Cu6Sn5 exhibits a gradually increasing bulk modulus (B). These findings suggest that doping improves the rigidity and elastic deformation properties of the two intermetallic compounds. And yet the anisotropy of both intermetallic compounds is decreasing as doping concentration increases. According to the calculations of the electronic structures, the doped (Ni,Co)3Sn4 structure and the doped η′‐(Cu,Co)6Sn5 structure exhibit stronger metallicity. In addition, stronger Co–Sn ionic bonds are formed in the doped Ni3Sn4 and η′‐Cu6Sn5 structures. This suggests that the doped Ni3Sn4 and η′‐Cu6Sn5 structures are harder.

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Dependence of shear strength of Sn–3.8Ag–0.7Cu/Co–P solder joints on the P content of Co–P metallization

Cited by 7 publications

References 34 publications

Mechanical Properties and Friction of AZ31 Magnesium Alloy and Application to the Cylidrical Deep Drawing Process

Mechanical Properties and Friction of AZ31 Magnesium Alloy and Application to the Cylidrical Deep Drawing Process

Study of an Active Heat‐Dissipating Liquid Metal Wire with Electrical‐Material Cotransmission Characteristics and Its Applications

Effect of Different Concentrations of Co Doping on the Properties of η′‐Cu₆Sn₅ and Ni₃Sn₄: First‐Principles Study

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Dependence of shear strength of Sn–3.8Ag–0.7Cu/Co–P solder joints on the P content of Co–P metallization

Cited by 7 publications

References 34 publications

Mechanical Properties and Friction of AZ31 Magnesium Alloy and Application to the Cylidrical Deep Drawing Process

Mechanical Properties and Friction of AZ31 Magnesium Alloy and Application to the Cylidrical Deep Drawing Process

Study of an Active Heat‐Dissipating Liquid Metal Wire with Electrical‐Material Cotransmission Characteristics and Its Applications

Effect of Different Concentrations of Co Doping on the Properties of η′‐Cu6Sn5 and Ni3Sn4: First‐Principles Study

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Product

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Effect of Different Concentrations of Co Doping on the Properties of η′‐Cu₆Sn₅ and Ni₃Sn₄: First‐Principles Study