In this paper we have analyzed the effect of size cohesive (binding) energies as a function of their particle size and number of atom-pairs in normalized per atom pair binding that fmds out their detailed atomistic bonding.(cohesive) energy and melting temperature of the Indium nitride Ramos et a. [6] have calculated the lattice constant, bulk ( InN ) nano-particle using simple model approach. It is observed modulus, cohesive energy and electronic band structures of that the per-atom-pair binding (cohesive) energy and melting silicon and the zinc-blende-type III-N semiconductor temperature are a quadratic function of the inverse of the particle size for InN nano-particle. The per atom-pair binding compounds BN, AIN, GaN, and InN by using the self-(cohesive) energy and melting temperature comes near that of consistent full potential linear augmented plane wave «FP their bulk value with increasing the particle size and same as the LAPW) method. Zoroddu et al. [7] have computed bulk bulk material when the particle size is above than tOO nm.properties as structure and cohesion, formation enthalpies, Keywords-Semiconductors; Size effect; B inding energy; spontaneous polarizations and piezoelectric constants, and Melting temperature; Nano-particle; Nano-c1uster. elastic constants of the zinc-blende and wurtzite III-V nitrides