Depolarization by Mercaptoacetic Acid During Electrodeposition of Copper

Sukava, A. J.; Winkler, C. A.

doi:10.1139/v56-016

Cited by 4 publications

(3 citation statements)

References 2 publications

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“…The decrease in the cathode potential in the presence of Cl − ion may be due to the ready discharge of the Cu 2+ -Cl − complex at the cathode [23].…”

Section: Discussionmentioning

confidence: 99%

Effects of Added Chloride Ion on Electrodeposition of Copper from a Simulated Acidic Sulfate Bath Containing Cobalt Ions

Panda

2013

ISRN Metallurgy

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The effects of added chloride ion on copper electrodeposition was studied using Pb-Sb anode and a stainless steel cathode in an acidic sulfate bath containing added Co2+ ion. The presence of added chloride ion in the electrolyte solution containing 150 ppm of Co2+ ion was found to increase the anode and the cell potentials and decrease the cathode potential. Linear sweep voltammetry (LSV) was used to study the effects of added chloride ion on the anodic process during the electrodeposition of copper in the presence of added ppm; the oxygen evolution potential is polarised by adding 10 ppm chloride ion at current densities (≥150 A/m2), and further increase in chloride ion concentration increases the polarisation of oxygen evolution reaction more at higher current densities. X-ray diffraction (XRD) showed that added chloride ion and added Co2+ ion changed the preferred crystal orientations of the copper deposits differently. Scanning electron microscopy (SEM) indicated that the surface morphology of the copper deposited in the presence of added chloride ion and added Co2+ ion has well-defined grains.

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“…The decrease in the cathode potential in the presence of Cl − ion may be due to the ready discharge of the Cu 2+ -Cl − complex at the cathode [23].…”

Section: Discussionmentioning

confidence: 99%

Effects of Added Chloride Ion on Electrodeposition of Copper from a Simulated Acidic Sulfate Bath Containing Cobalt Ions

Panda

2013

ISRN Metallurgy

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“…Literature [14] reports that the presence of Cl Ϫ depolarizes the cathode potential that is assumed to be due to the ready discharge of the Cu 2ϩ -Cl Ϫ complex at the cathode. It would be reasonable to assume the formation (and involvement) of a transient complex in the present case, because complexes involving sulfite ions and copper [22] and other bivalent metal ions [23] are known; the stability constant for a complex arising from Cu 2ϩ (aq) and sulfite ion is also reported.…”

Section: G Interpretationsmentioning

confidence: 99%

“…However, the cathodic aspects of copper deposition have received comparatively less attention in the presence of anode depolarizers. A few studies [14][15][16][17] report on the cathodic depolarization in copper deposition in the presence of some inorganic and organic compounds. In our earlier communication, [6,8] studies on some aspects of the anodic behavior of several added depolarizers such as H 2 SO 3 , Co 2ϩ (aq), or both, have been carried out on graphite anode.…”

Section: Introductionmentioning

confidence: 99%

Cathodic deposition of copper in the presence of aqueous sulfurous acid, bivalent aquacobalt ion, or both using a stainless steel cathode and a graphite anode

Panda

Das

Panda

2003

Metall Mater Trans B

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A study on cathodic deposition of copper in acidic aqueous sulfate solution has been carried out using a stainless steel cathode and a graphite anode. The individual and the combined effects of added [H 2 SO 3и aq] and [Co 2ϩ и aq] on cathode potential, current efficiency, crystal orientations, and deposit morphology have been investigated and are compared. The maximum decrease of ഡ50 pct in cathode potential is more pronounced in the presence of ഡ10.25 g/L of H 2 SO 3 alone in the electrolyte than that (ഡ30 pct) in the presence of ഡ100 ppm of added Co 2ϩ (aq) alone; however, the presence of added Co 2ϩ (aq) along with H 2 SO 3 (aq) does not cause further decrease in cathode potential in comparison to that observed in the presence of only H 2 SO 3 (aq) in the electrolyte. The current efficiency is found to decrease in the presence of [H 2 SO 3и aq] in the range of 1.32 to 30.75 g/L or in the presence of added [Co 2ϩ и aq] in the range of ഡ10 ppm to 600 ppm, while the decrease of about 4 pct in current efficiency is more pronounced in the presence of only H 2 SO 3 (aq) in the electrolyte, it is about 2 pct in the presence of only added Co 2ϩ (aq) in the same electrolyte. The addition of Co 2ϩ (aq) to the electrolyte containing H 2 SO 3 (aq) does not alter the current efficiency (94 pct) of copper at the cathode. The linear sweep voltammetry (LSV) method was used to study the effect of added [H 2 SO 3и aq], [Co 2ϩ и aq], or both, on the copper deposition at the cathode. The presence of each of these two additives or both causes a depolarization effect; the extent of the depolarization depends on the concentration of H 2 SO 3 (aq), Co 2ϩ (aq), and the current density. X-ray diffraction (XRD) data suggest that there is a change in the order of the preferred crystal orientations (viz., from the (220) plane in the absence of added H 2 SO 3 (aq) and Co 2ϩ (aq) to the (111) plane in the presence of added H 2 SO 3 (aq) and Co 2ϩ (aq) in the electrolyte solution) due to a change in the preferred plane of relative crystal growth. Results of scanning electron microscopy (SEM) indicate that cathode deposits of better surface morphology due to small-sized crystallites are found in the presence of added H 2 SO 3 (aq) ϩ Co 2ϩ (aq) in the electrolyte solution.

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Synergistic effects of added bivalent aqua cobalt ion, bivalent aqua iron ion and aqueous sulfurous acid on a graphite anode during electrodeposition of copper from a sulfate bath

2004

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Depolarization by Mercaptoacetic Acid During Electrodeposition of Copper

Cited by 4 publications

References 2 publications

Effects of Added Chloride Ion on Electrodeposition of Copper from a Simulated Acidic Sulfate Bath Containing Cobalt Ions

Effects of Added Chloride Ion on Electrodeposition of Copper from a Simulated Acidic Sulfate Bath Containing Cobalt Ions

Cathodic deposition of copper in the presence of aqueous sulfurous acid, bivalent aquacobalt ion, or both using a stainless steel cathode and a graphite anode

Synergistic effects of added bivalent aqua cobalt ion, bivalent aqua iron ion and aqueous sulfurous acid on a graphite anode during electrodeposition of copper from a sulfate bath

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