2014
DOI: 10.1016/j.apsusc.2013.11.034
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Deposition of Cr–Si–Ni–Mo films at a low sputtering current and performance of heat and humid resistance

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Cited by 10 publications
(2 citation statements)
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“…On the other hand, some attempts have been made to study Mn-based antiperovskite structures like Mn3CuN and Mn3NiN [10,26,34] in thin film form but none include partial substitution by a third element like Ag or Cu, to achieve ultra-low TCR values on ceramic substrates like alumina as used commonly in the fabrication of real world passive components. In this work, we demonstrate for the first time, the sputter deposition and heat treatment of Mn3AgCuN antiperovskite thin film structures with TCR values better than 5 ppm/˚C and sheet resistance and stability values comparable to the well-established Ni-Cr material systems [35], thereby, opening potential application within ultra-precise thin film passive component fabrication.…”
Section: Introductionmentioning
confidence: 89%
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“…On the other hand, some attempts have been made to study Mn-based antiperovskite structures like Mn3CuN and Mn3NiN [10,26,34] in thin film form but none include partial substitution by a third element like Ag or Cu, to achieve ultra-low TCR values on ceramic substrates like alumina as used commonly in the fabrication of real world passive components. In this work, we demonstrate for the first time, the sputter deposition and heat treatment of Mn3AgCuN antiperovskite thin film structures with TCR values better than 5 ppm/˚C and sheet resistance and stability values comparable to the well-established Ni-Cr material systems [35], thereby, opening potential application within ultra-precise thin film passive component fabrication.…”
Section: Introductionmentioning
confidence: 89%
“…Results of the dry heat resistance stability test for all six film compositions is also shown in figure 3(a) with drastic improvements with increasing Cu concentration down to 0.85% for x = 1. The stability value of 0.85% is very promising [35] and this value can be improved by adding further layers of protection resin coatings similar to process stages from a thin film resistor (TFR) fabrication cycle to improve the resistance stability value of high precision resistors [39]. effect which increases the sheet resistance due to oxidation of the film at higher temperatures [40][41][42][43].…”
Section: Electrical Characterizationmentioning
confidence: 99%