Deposition of Cu/a-C:H Nanocomposite Films

Abstract

In the present study is shown a novel vacuum‐based technique that enables production of hard polymeric nanocomposite coatings with metal (Cu) nanoparticles. This method is based on the use of gas aggregation source (GAS) of Cu nanoparticles and plasma‐enhanced chemical vapour deposition of a‐C:H matrix that was deposited in a mixture of Ar and n‐hexane on the substrates placed on the powered RF electrode. This approach makes it possible to control independently both the properties of the matrix by variation of the applied RF power and the amount of incorporated Cu nanoparticles that may be adjusted by operational parameters of the GAS. Characterisation of the films in terms of their chemical composition, morphology, optical and mechanical properties is described here alongside with description of Cu nanoparticles production using GAS with variable aggregation length.

Effect of magnetic field on the formation of Cu nanoparticles during magnetron sputtering in the gas aggregation cluster source

“…Even though the pressure increase was realized by the increase of the flow rate of Ar, the changes in velocity of neutral gas and hence the changes in the residence time of NPs in the aggregation/growth region are in this case almost negligible. The changes in NP size are caused by less effective formation of condensation seeds at lower pressure, as we already explained in more detail in our previous studies …”

Core@shell Cu/hydrocarbon plasma polymer nanoparticles prepared by gas aggregation cluster source followed by in‐flight plasma polymer coating

“…Ar flow was 4 sccm that corresponded to pressure 40 Pa inside the aggregation chamber 40. Under such conditions almost 10% of sputtered Cu atoms are bound in produced NPs, that is, efficiency in metal utilization is around 10% and the deposition rate is aproximatelly 0.1 mg min −1 …”

“…Under such conditions almost 10% of sputtered Cu atoms are bound in produced NPs, that is, efficiency in metal utilization is around 10% and the deposition rate is aproximatelly 0.1 mg min −1 . [3] In order to coat Cu NPs by plasma polymer shells a glass cylinder (inner diameter 92 mm, length 200 mm) with outer metal electrode was introduced in between the output orifice and the grounded substrate holder (see Figure 1). This auxiliary plasma source was powered by a RF power source (Dressler Ceasar, 13.56 MHz) connected to the outer electrode through a manually operated matching network.…”

“…Such gas aggregation sources of nanoparticles (GAS), introduced in the early‐1990s of the last century by Haberland et al, posseses in comparison with techniques based on chemical synthesis advantageous features such as relative simple and effective production of NPs, no or only limited use of potentially harmful solvents or chemical precursors as well as the possibility to combine the gas aggregation sources of nanoparticles with other vacuum‐based deposition methods. The latter enabled production of complex functional nanocomposite or nanostructured materials with different architectures including classical nanocomposites or multi‐layered structures, coatings with dual‐scale roughness, or materials with horizontal gradients of NPs embedded into a matrix material . Furthermore, the GAS systems were proved to be highly flexible also in terms of composition of produced NPs as they enabled fabrication of metallic, metal‐oxide as well as polymeric NPs …”

Deposition of Ag/a-C:H nanocomposite films with Ag surface enrichment

“…Regarding to the first mentioned aspect, the use of metal/plasma polymer nanocomposites is often hampered by the fact that plasma polymer is rather soft and does not withstand usual wear abrasion. Therefore in our previous work, we decided to grow hydrocarbon plasma polymer matrix under positive ion bombardment that result in growth of hard plasma polymer (C:H) or even amorphous hydrogenated carbon (a‐C:H) . Copper nanoparticles were in this study simultaneously delivered from the GAS in contrary to usual preparation technique based on metal magnetron sputtering combined with plasma polymerization (PECVD) of a hydrocarbon gas added to the working gas argon .…”