Deposition of Cubic Copper Nanoparticles on Silicon Laser-Induced Periodic Surface Structures via Reactive Laser Ablation in Liquid

Broadhead, Eric J.; Monroe, Avery; Tibbetts, Katharine Moore

doi:10.1021/acs.langmuir.1c00238

Cited by 17 publications

(19 citation statements)

References 71 publications

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“…A total of five metal combinations were tested: Au–Cu, Au–Fe, Au–Zn, Cu–Fe, and Cu–Zn. To maximize metal deposition, KOH was added dropwise to the working solutions in order to achieve a pH in the range of 5.2–6.8. , The working solutions were prepared 18–24 h prior to laser processing and were stored at 6 °C. For each sample, 3.0 mL of the working solution was transferred to a 10 × 10 × 40 mm quartz fluorimeter cuvette that was cleaned with aqua regia, rinsed with water, and then equilibrated to room temperature.…”

Section: Methodsmentioning

confidence: 99%

Enhancement of Metal Nanostructure Deposition on Silicon Laser-Induced Periodic Surface Structures by Galvanic Replacement

Simpson,

Broadhead,

Casto

et al. 2023

Langmuir

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We report a chemically motivated, single-step method to enhance metal deposition onto silicon laser-induced periodic surface structures (LIPSSs) using reactive laser ablation in liquid (RLAL). Galvanic replacement (GR) reactions were used in conjunction with RLAL (GR-RLAL) to promote the deposition of Au and Cu nanostructures onto a Si LIPSS. To increase the deposition of Au, sacrificial metals Cu, Fe, and Zn were used; Fe and Zn also enhanced the deposition of Cu. We show that the deposited metal content, surface morphology, and metal crystallite size can be tuned based on the difference in electrochemical potentials of the deposited and sacrificial metal. Compared to the Au and Cu reference samples, GR more than doubled the metal content on the LIPSS and reduced metal crystallite sizes by up to 20%. The ability to tune the metal content and crystalline domain size simultaneously makes GR-RLAL a potentially useful approach in the manufacturing of functional metal-LIPSS materials such as surface-enhanced Raman spectroscopy substrates.

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Section: Methodsmentioning

confidence: 99%

Enhancement of Metal Nanostructure Deposition on Silicon Laser-Induced Periodic Surface Structures by Galvanic Replacement

Simpson,

Broadhead,

Casto

et al. 2023

Langmuir

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“…Figure 6b [71]. Interestingly, the intensity of the Cu(II)O peak significantly decreases accompanied by an increase of Cu(I)O as a function of sputtering depth.…”

mentioning

confidence: 88%

“…In comparison, Cu(II)O is detected in the spectra of the plasma-treated electrodes independent of the processing time, as shown in Figure 6a. To further investigate the oxidation states of the plasma-modified Cu electrode, an XPS depth profiling measurement was performed with different sputter depth rates of 3, 10, and 30 nm min -1 for the samples treated at 525 V for 60 s, as demonstrated in [71] Interestingly, the intensity of the Cu(II)O peak significantly decreases accompanied by an increase of Cu(I)O as a function of sputtering depth. More importantly, Cu(II)O cannot be detected after 30 min.…”

Section: Surface Characterizationmentioning

confidence: 99%

In‐Liquid Plasma for Surface Engineering of Cu Electrodes with Incorporated SiO₂ Nanoparticles: From Micro to Nano

Menezes

Elnagar

Al-Shakran

et al. 2021

Adv Funct Materials

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A robust and efficient route to modify the chemical and physical properties of polycrystalline copper (Cu) wires via versatile plasma electrolysis is presented. Silica (SiO 2 ) nanoparticles (11 nm) are introduced during the electrolysis to tailor the surface structure of the Cu electrode. The influence of these SiO 2 nanoparticles on the structure of the Cu electrodes during plasma electrolysis over a wide array of applied voltages and processing time is investigated systematically. Homogeneously distributed 3D coral-like microstructures are observed by scanning electron microscopy on the Cu surface after the in-liquid plasma treatment. These 3D microstructures grow with increasing plasma processing time. Interestingly, the microstructured copper electrode is composed of CuO as a thin outer layer and a significant amount of inner Cu 2 O. Furthermore, the oxide film thickness (between 1 and 70 µm), the surface morphology, and the chemical composition can be tuned by controlling the plasma parameters. Remarkably, the fabricated microstructures can be transformed to nanospheres assembled in coral-like microstructures by a simple electrochemical treatment.

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“…of Cu(I) and Cu(0) species are very close) [64,65] . Based on the obtained spectra, we 5b [66] . Interestingly, the intensity of the Cu [67,68] .…”

Section: Surface Characterizationmentioning

confidence: 99%

In-liquid plasma for surface engineering of Cu electrodes with incorporated SiO2 nanoparticles: From micro to nano

Menezes

Elnagar

Al-Shakran

et al. 2021

Preprint

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A robust and efficient route to modify the chemical and physical properties of polycrystalline Cu wires via versatile plasma electrolysis is presented. Silica nanoparticles (11 nm) have been introduced during the electrolysis to tailor the surface structure of the Cu electrode. The influence of these silica nanoparticles on the structure of the Cu electrodes during plasma electrolysis over a wide array of applied voltages and processing time is investigated systematically. Homogeneously distributed 3D coral-like microstructures are observed by scanning electron microscopy on the Cu surface after the in-liquid plasma treatment. These 3D microstructures grow with increasing plasma processing time. Interestingly, the microstructured copper electrode is composed of Cu(II) oxide as a thin outer shell and a significant amount of inner Cu(I) oxide. Furthermore, the oxide film thickness (between 1 and 70 µm), the surface morphology, and the chemical composition can be tuned by controlling the plasma parameters. Remarkably, the fabricated microstructures can be transformed to nanospheres assembled in coral-like microstructures by a simple electrochemical treatment.

show abstract

Deposition of Cubic Copper Nanoparticles on Silicon Laser-Induced Periodic Surface Structures via Reactive Laser Ablation in Liquid

Cited by 17 publications

References 71 publications

Enhancement of Metal Nanostructure Deposition on Silicon Laser-Induced Periodic Surface Structures by Galvanic Replacement

Enhancement of Metal Nanostructure Deposition on Silicon Laser-Induced Periodic Surface Structures by Galvanic Replacement

In‐Liquid Plasma for Surface Engineering of Cu Electrodes with Incorporated SiO₂ Nanoparticles: From Micro to Nano

In-liquid plasma for surface engineering of Cu electrodes with incorporated SiO2 nanoparticles: From micro to nano

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Deposition of Cubic Copper Nanoparticles on Silicon Laser-Induced Periodic Surface Structures via Reactive Laser Ablation in Liquid

Cited by 17 publications

References 71 publications

Enhancement of Metal Nanostructure Deposition on Silicon Laser-Induced Periodic Surface Structures by Galvanic Replacement

Enhancement of Metal Nanostructure Deposition on Silicon Laser-Induced Periodic Surface Structures by Galvanic Replacement

In‐Liquid Plasma for Surface Engineering of Cu Electrodes with Incorporated SiO2 Nanoparticles: From Micro to Nano

In-liquid plasma for surface engineering of Cu electrodes with incorporated SiO2 nanoparticles: From micro to nano

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In‐Liquid Plasma for Surface Engineering of Cu Electrodes with Incorporated SiO₂ Nanoparticles: From Micro to Nano