2009
DOI: 10.1016/j.surfcoat.2009.04.022
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Deposition of dense and smooth Ti films using ECR plasma-assisted magnetron sputtering

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Cited by 18 publications
(7 citation statements)
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“…The leakage current test of insulators with and without deposition was also performed before and after being subjected to artificial salt spray weathering for alternating current systems with nominal voltages higher than 1000 V [13][14][15][16][17][18][19][20][21][22][23][24][25][26][27][28][29] .…”
Section: Characterization Of the Materialsmentioning
confidence: 99%
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“…The leakage current test of insulators with and without deposition was also performed before and after being subjected to artificial salt spray weathering for alternating current systems with nominal voltages higher than 1000 V [13][14][15][16][17][18][19][20][21][22][23][24][25][26][27][28][29] .…”
Section: Characterization Of the Materialsmentioning
confidence: 99%
“…Such coatings can alter the wetting properties of the surface formed once the OH -groupings are substituted. Additionally, titanium films have high mechanical strength, excellent thermal stability and good corrosion resistance in highly aggressive environments [18][19][20] . In processes that involve cold plasmas, some determining factors must be defined: the energy source, feed system and the choice of the precursor gases, reactor type and the types of substrates, with the latter and the geometric factors related to the surroundings of the plasma phase being crucial to the efficiency of these processes 21 .…”
Section: Introductionmentioning
confidence: 99%
“…The microstructural and optical properties of the materials synthesized in the vacuum chamber strongly depend on the growing conditions (e.g., a pressure of working/reactive gas, deposition rate, substrate temperature, and the bias applied) [1]. There are various methods used to increase energy of condensed particles, e.g., heating of the substrate (and/or post-deposition annealing) [2,3], plasma bombardment [4], increasing of the power of the supplier [3,5]. Sometimes the additional voltage, the bias, is applied during the coating formation process [4,6,7].…”
Section: Introductionmentioning
confidence: 99%
“…There are various methods used to increase energy of condensed particles, e.g., heating of the substrate (and/or post-deposition annealing) [2,3], plasma bombardment [4], increasing of the power of the supplier [3,5]. Sometimes the additional voltage, the bias, is applied during the coating formation process [4,6,7]. Those methods lead to increasing the kinetic energy of particles dissipated due to the inter-particle collisions.…”
Section: Introductionmentioning
confidence: 99%
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