2014
DOI: 10.1039/c3tc31935k
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Deposition of nonpolar m-plane InGaN/GaN multiple quantum wells on LiGaO2(100) substrates

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Cited by 48 publications
(51 citation statements)
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“…Meanwhile, sapphire has a low thermal conductivity of $ 25 W/m K that hinders the thermal dispatch during the device application and hence the development of high-power group III-nitride devices. What's more, group III-nitride devices prepared on sapphire are mainly along the [0001] c-axis, where strong spontaneous and strained-induced piezoelectric polarization exist [7][8][9][10]. The internal electric field caused by this polarization leads to the separation of carriers in the quantum wells (so called quantum-confined Stark effect, QCSE) and thereby a reduced quantum efficiency and a quicker efficiency droop [7][8][9][10].…”
Section: Introductionmentioning
confidence: 98%
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“…Meanwhile, sapphire has a low thermal conductivity of $ 25 W/m K that hinders the thermal dispatch during the device application and hence the development of high-power group III-nitride devices. What's more, group III-nitride devices prepared on sapphire are mainly along the [0001] c-axis, where strong spontaneous and strained-induced piezoelectric polarization exist [7][8][9][10]. The internal electric field caused by this polarization leads to the separation of carriers in the quantum wells (so called quantum-confined Stark effect, QCSE) and thereby a reduced quantum efficiency and a quicker efficiency droop [7][8][9][10].…”
Section: Introductionmentioning
confidence: 98%
“…At present, sapphire is still the most popular commercial substrate for epitaxial growth of group III-nitride devices. However, due to the relatively large lattice mismatch between sapphire and group III-nitrides, high-density dislocations still exist in the group III-nitride devices, which may serve as nonradiative recombination centers, and eventually deteriorate the performance of group III-nitride devices [8][9][10]. Meanwhile, sapphire has a low thermal conductivity of $ 25 W/m K that hinders the thermal dispatch during the device application and hence the development of high-power group III-nitride devices.…”
Section: Introductionmentioning
confidence: 99%
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