Backscattering spectrometry is used to investigate the depth dependence of NiSi atomic mixing induced by 300 keV Xe+ ions. Nickel films with thicknesses of 40, 64, 68, and 97 nm are deposited on 〈100〉 Si substrates and irradiated at various temperatures. The numbers of metal atoms per unit area mixed with the silicon substrates are calculated from the backscattering spectra. The results show that the ion mixing process takes place at a depth much greater than that of the ion‐induced cascade, even at about −180 °C. The temperature dependence of the ion mixing is measured for 64 nm Ni on 〈100〉 Si and for 40 nm Pt on 〈100〉 Si between −180 and 160 °C. The results suggest that the formation of compound phases plays an important role in the atomic mixing, even at −180 °C.