Depth profile reconstructions of electronic transport properties in H+ MeV-energy ion-implanted n-Si wafers using photocarrier radiometry

Abstract

Articles you may be interested inPhotocarrier radiometry of ion-implanted and thermally annealed silicon wafers with multiple-wavelength excitations J. Appl. Phys. 111, 093729 (2012); 10.1063/1.4716032Photocarrier radiometric and ellipsometric characterization of ion-implanted silicon wafers A depth profiling technique using photocarrier radiometry (PCR) is demonstrated and used for the reconstruction of continuously varying electronic transport properties (carrier lifetime and electronic diffusivity) in the interim region between the ion residence layer and the bulk crystalline layer in H þ implanted semiconductor wafers with high implantation energies ($MeV). This defect-rich region, which is normally assumed to be part of the homogeneous "substrate" in all existing two-and three-layer models, was sliced into many virtual thin layers along the depth direction so that the continuously and monotonically variable electronic properties across its thickness can be considered uniform within each virtual layer. The depth profile reconstruction of both carrier life time and diffusivity in H þ implanted wafers with several implantation doses (3 Â 10 14 , 3 Â 10 15 , and 3 Â 10 16 cm À2 ) and different implantation energies (from 0.75 to 2.0 MeV) is presented. This all-optical PCR method provides a fast non-destructive way of characterizing sub-surface process-induced electronic defect profiles in devices under fabrication at any intermediate stage before final metallization and possibly lead to process correction and optimization well before electrical testing and defect diagnosis becomes possible. V C 2014 AIP Publishing LLC. [http://dx.