2013
DOI: 10.7567/jjap.52.03bb03
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Depth-Profiling Study on Amorphous Indium–Gallium–Zinc Oxide Thin-Film Transistors by X-ray Photoelectron Spectroscopy

Abstract: We performed an X-ray photoelectron spectroscopy (XPS) depth-profiling study on the materials used in amorphous indium–gallium–zinc oxide thin-film transistors (a-IGZO TFTs) with Ti and Mo source/drain (S/D) electrodes. The XPS results suggested that there are some differences between the interface regions of Ti/a-IGZO and Mo/a-IGZO for different chemical states of the materials. The chemical states of the back-channel surfaces were also found to be different between the TFTs with Ti and Mo S/D electrodes. In … Show more

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Cited by 9 publications
(4 citation statements)
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“…Figures 3(a)-(c) show the XPS spectra for In 3d, Ga 2p and Zn 2p for a-IGZO film. There is no obvious difference between these In, Ga, Zn XPS spectra and those in a previous report [32]. The O 1s spectrum distinguishes V o , which are the most important defects in IGZO films.…”
Section: Materials Analysiscontrasting
confidence: 39%
“…Figures 3(a)-(c) show the XPS spectra for In 3d, Ga 2p and Zn 2p for a-IGZO film. There is no obvious difference between these In, Ga, Zn XPS spectra and those in a previous report [32]. The O 1s spectrum distinguishes V o , which are the most important defects in IGZO films.…”
Section: Materials Analysiscontrasting
confidence: 39%
“…Figure 2b depicts the XPS spectrum of In 3d 5/2 in the V Orich layer of high-In ITZO. It can be divided into two peaks, one from the oxide with the stoichiometric composition located near 444.8 eV and the other from the oxide state with oxygen deficiency located at 443.1 eV, 26 and Figure 2c depicts similar phenomena in the Sn 3d 5/2 spectrum. 27 These suggest that the back channel of ITZO shows a clear tendency of metallization, coupling well with its V O -rich state.…”
Section: Resultsmentioning
confidence: 92%
“…Up to now, mainly three types of oxide TFTs have been researched and developed. The first is a back channel etch (BCE)-type TFT that applies a process similar to that of the amorphous silicon (a-Si) TFT and etches source and drain (S/D) metal to form a back channel (6,9). The second is an etch stop layer (ESL)-type TFT that is protected by an ESL in advance to prevent the back-channel interface from being exposed to etching (7,10).…”
Section: Introductionmentioning
confidence: 99%