2021
DOI: 10.1016/j.mee.2021.111510
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Design and analysis of Cu circuit for stretchable electronic circuits using finite element analysis

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Cited by 4 publications
(3 citation statements)
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“…Because P1.2 is a pattern with rounded corners with a radius of 0.5 mm, the stress was expected to be dispersed by the rounded corners, thus resulting in better stretchability than that of P1.1. [31,32] Based on the first simulation analysis results, the second group of patterns, excluding the complex and rigid designs (such as P1.3 and P1.4), was designed (Figure 2a). The P2.1 pattern exhibited the best stretchability in the first simulation.…”
Section: Resultsmentioning
confidence: 99%
“…Because P1.2 is a pattern with rounded corners with a radius of 0.5 mm, the stress was expected to be dispersed by the rounded corners, thus resulting in better stretchability than that of P1.1. [31,32] Based on the first simulation analysis results, the second group of patterns, excluding the complex and rigid designs (such as P1.3 and P1.4), was designed (Figure 2a). The P2.1 pattern exhibited the best stretchability in the first simulation.…”
Section: Resultsmentioning
confidence: 99%
“…Among the materials used as conductive ink in SEC applications are graphene [16], silver [17], and copper [18,19]. Both thermoplastic-urethane (TPU) substrate and copper conductive ink utilized within this research is adapted from Kim et al, [20]. The material properties are tabulated in Table 1.…”
Section: Materials Propertiesmentioning
confidence: 99%
“…For example, environmental factors such as dust, moisture, and vibration may accelerate component failure. In addition, chemicals and radiation in the environment may also cause damage to electronic components [3]. Therefore, reasonable use and maintenance of components are also key to extending their lifespan.…”
Section: Introductionmentioning
confidence: 99%