Design and Analysis of Logic-HBM2E Power Delivery System on CoWoS<sup>®</sup> Platform with Deep Trench Capacitor

Chen, W. T.; Lin, Chin‐Wen; Tsai, Chien‐Hsiung; Hsia, H.; Ting, Kong; Hou, S. Y.; Wang, C. T.; Yu, Douglas

doi:10.1109/ectc32862.2020.00068

Cited by 18 publications

(1 citation statement)

References 14 publications

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“…Through-silicon-vias (TSVs), the biggest feature of 3D-SICs, enable vertical signal transfer among stacked ICs which enhances performance and energy by optimized signal lines between stacked ICs [8][9][10][11][12][13]. Although wider signal bus is required for enormous scale data transfer, densely manufactured signal bus needs to solve crosstalk among the channels [14][15][16][17][18][19][20] as well as power line noise [21][22][23][24][25][26][27]. To avoid bit error caused by such crosstalk, it requires frequency or voltage optimization that cause additional issues like lower data transfer speed or larger power consumption, respectively [28,29].…”

Section: Introductionmentioning

confidence: 99%

Analysis and evaluation of noise coupling between through-silicon-vias

Araga

Watanabe

Shimamoto

et al. 2021

IEICE Electron. Express

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Three-dimensional stacking of ICs with through-silicon-vias (TSVs) is one of the most expected way to integrate an enormous scale system in a small footprint. Shortened distance and expanded interconnect area are proofed to enable low-power, ultra-wide bandwidth communication among logic, memory, and analog component. In the 3-D integrated system with massive vertical interconnects, noise coupling among TSVs can be problem, by degrading signal integrity. We made a simple model to estimate noise coupling among TSVs and analyzed the coupling strength against parasitic capacitance of liner oxide. A test chip is fabricated, and the noise coupling strength is evaluated through on-chip waveform capturing circuitry. The analytical result and measured result show good consistency, and they indicate smaller size TSVs show better noise isolation characteristics as well as process simplicity.

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