Design and analysis of the film assembly of thermo-optic infrared focal plane arrays

Abstract

In order to improve the detection sensitivity of thermo-optic infrared focal plane arrays (TOFPA), we analyzed the optical characteristics of TOFPA and the influence of pairs of high/low index films (H/L, amorphous silicon and silicon nitride) with their extinction coefficients measured by spectroscopic ellipsometry. The results show that increasing the pairs initially increases and subsequently decreases the thermo-optic sensitivity of TOFPA because of the optical absorption of readout light, and slightly enhances the infrared absorption of the target source (8-14 lm). Finally, the TOFPA with thermo-optic sensitivity 6.23% K -1 and average infrared absorption 65.2%, employing an optimizing film assembly air| hHLi 2 30.1H hLH i 2 16L|substrate, is fabricated by micro electromechanical system technologies.

The thermal-mechanical performance of the uncooled infrared optical-readout bi-material FPA

“…So the authorities such as University of california in Berkley (Varesi et al 1997;Mao et al 1999;Zhao and Mao 2002), Oak ridge national laboratory (Senesac et al 2003;Grbovic et al 2008); turkey (Ferhanoglu et al 2007), Boston University (huang et al 2008;Kwon et al 2009) and Shanghai Institute of Microsysytem and Information Technology, caS (Yan et al 2009) had concentrated on the research for about 7-10 years and also shown a lot of inspiring results. During 2007During -2013, we had also presented a novel Ir-FPa and successfully developed the model prototype of the infrared camera (Dong et al 2007;Jiao et al 2007;Yan-mei et al 2011).…”