Design and Characterization of a Dual-Mode CMOS-MEMS Resonator for TCF Manipulation

Li, Ming-Huang; Chen, Chao‐Yu; Li, Cheng-Syun; Chin, Chih‐Chien; Li, Sheng-Shian

doi:10.1109/jmems.2014.2332884

Cited by 28 publications

(11 citation statements)

References 20 publications

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“…We will thus focus the discussion on increasing the TCF of our devices. Some interesting works have already shown a TCF up to 1000 ppm/°C, improving thereby the TCF by a factor 20 [57], [58]. In particular, the 1 st order phase transition of diverse materials has been used to obtain…”

Section:  Thermal Responsementioning

confidence: 99%

Array of Resonant Electromechanical Nanosystems: A Technological Breakthrough for Uncooled Infrared Imaging

Duraffourg

Laurent

Moulet

et al. 2018

Preprint

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Microbolometer is the most common uncooled infrared technique that allows to achieve 50mK-temperature resolution on the scene. However, this approach has to struggle with both the self-heating inherent to the resistive readout principle and the 1/f noise. We present an alternative approach that consists in using micro / nanoresonators vibrating according to a torsional mode, and whose resonant frequency changes with the incident IR-radiation. Dense arrays of such electromechanical structures were fabricated with a 12µm-pitch at low temperature allowing their integration on CMOS circuits according to a post-processing method. H-shape pixels with 9 µm-long nano-rods and a cross-section of 250 × 30 nm² were fabricated to provide large thermal responses, whose experimental measurements reached up to 1024 Hz/nW. These electromechanical resonators featured a noise equivalent power of 140pW for a response time of less than 1 ms. To our knowledge, these performance are unrivaled with such small dimensions. We also showed that a temperature sensitivity of 20 mK within 100ms-integration time is conceivable at a 12µm-pitch by co-integrating the resonators with their readout electronics and suggesting a new readout scheme. This sensitivity could be reached at short-term by depositing on top of the nano-rods a vanadium oxide layer having a phase-transition that could possibly enhance the thermal response by one order of magnitude.

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Section:  Thermal Responsementioning

confidence: 99%

Array of Resonant Electromechanical Nanosystems: A Technological Breakthrough for Uncooled Infrared Imaging

Duraffourg

Laurent

Moulet

et al. 2018

Preprint

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“…An intermediate CMOS metal layer is used as a sacrificial layer and is removed by H 2 SO 4 + H 2 O 2 wet etching. CMOS MEMS resonators and accelerometers fabricated using a similar process have also been reported [ 43 , 44 ]. Polymers sensitive to analytes can be coated on finished CMOS MEMS structures for chemical and biological sensing.…”

Section: Post-cmos Memsmentioning

confidence: 99%

CMOS MEMS Fabrication Technologies and Devices

2016

Micromachines

114

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This paper reviews CMOS (complementary metal-oxide-semiconductor) MEMS (micro-electro-mechanical systems) fabrication technologies and enabled micro devices of various sensors and actuators. The technologies are classified based on the sequence of the fabrication of CMOS circuitry and MEMS elements, while SOI (silicon-on-insulator) CMOS MEMS are introduced separately. Introduction of associated devices follows the description of the respective CMOS MEMS technologies. Due to the vast array of CMOS MEMS devices, this review focuses only on the most typical MEMS sensors and actuators including pressure sensors, inertial sensors, frequency reference devices and actuators utilizing different physics effects and the fabrication processes introduced. Moreover, the incorporation of MEMS and CMOS is limited to monolithic integration, meaning wafer-bonding-based stacking and other integration approaches, despite their advantages, are excluded from the discussion. Both competitive industrial products and state-of-the-art research results on CMOS MEMS are covered.

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“…Microrings are a common resonator of MEMS (a microelectromechanical system), which are widely applied to MEMS sensors and actuators [1][2][3][4]. The ring resonators are usually operating in two kinds of vibrating mode, i.e.…”

Section: Introductionmentioning

confidence: 99%

Entropy Generation and Thermoelastic Damping in the In-plane Vibration of Microring Resonators

Tai

Zheng

et al. 2019

Entropy

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Thermoelastic damping is a critical issue for designing very high quality factor microresonators. This paper derives the entropy generation, associated with the irreversibility in heat conduction, that is used for ring resonators in in-plane vibration and presents an analytical model of thermoelastic damping according to heat increments calculated by entropy theory. We consider the heat flow only in radial thickness of the ring and obtain a complex temperature field that is out of phase with the mechanical stress. The thermoelastic dissipation is calculated in the perspective of heat increments that appear due to entropy generation. The analytical model is validated by comparing with an LR (Lifshitz and Roukes) model, finite-element method and measurement. The accuracy of the present model is found to be very high for different ambient temperatures and structures. The effects of structure dimensions and vibration frequencies on entropy generation and thermoelastic damping is investigated for ring resonators under in-plane vibration.

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Design and Characterization of a Dual-Mode CMOS-MEMS Resonator for TCF Manipulation

Cited by 28 publications

References 20 publications

Array of Resonant Electromechanical Nanosystems: A Technological Breakthrough for Uncooled Infrared Imaging

Array of Resonant Electromechanical Nanosystems: A Technological Breakthrough for Uncooled Infrared Imaging

CMOS MEMS Fabrication Technologies and Devices

Entropy Generation and Thermoelastic Damping in the In-plane Vibration of Microring Resonators

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