Design and demonstration of large 2.5D glass interposer for high bandwidth applications

Sakai, Taiji; Sawyer, Brett; Lü, Hao; Takagi, Yutaka; Furuya, Ryuta; Suzuki, Yuya; Kobayashi, Makoto; Smet, Vanessa; Tummala, Rao

doi:10.1109/icsj.2014.7009629

Cited by 7 publications

(2 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Indeed, they offer a level of integration between a PCB and an integrated circuit [ 161 ]. Glass and quartz interposers have great interest by the research community because of the high substrate isolation that increases RF capabilities compared to lossy silicon substrates [ 162 , 163 ]. Even if glass and quartz substrates are good candidates for RF transmission, large area commercial interposer applications are limited with those materials [ 164 ].…”

Section: Perspective Of 3d Pdc For Radiation Instrumentationmentioning

confidence: 99%

3D Photon-To-Digital Converter for Radiation Instrumentation: Motivation and Future Works

Pratte

Nolet

Parent

et al. 2021

Sensors

View full text Add to dashboard Cite

Analog and digital SiPMs have revolutionized the field of radiation instrumentation by replacing both avalanche photodiodes and photomultiplier tubes in many applications. However, multiple applications require greater performance than the current SiPMs are capable of, for example timing resolution for time-of-flight positron emission tomography and time-of-flight computed tomography, and mitigation of the large output capacitance of SiPM array for large-scale time projection chambers for liquid argon and liquid xenon experiments. In this contribution, the case will be made that 3D photon-to-digital converters, also known as 3D digital SiPMs, have a potentially superior performance over analog and 2D digital SiPMs. A review of 3D photon-to-digital converters is presented along with various applications where they can make a difference, such as time-of-flight medical imaging systems and low-background experiments in noble liquids. Finally, a review of the key design choices that must be made to obtain an optimized 3D photon-to-digital converter for radiation instrumentation, more specifically the single-photon avalanche diode array, the CMOS technology, the quenching circuit, the time-to-digital converter, the digital signal processing and the system level integration, are discussed in detail.

show abstract

Section: Perspective Of 3d Pdc For Radiation Instrumentationmentioning

confidence: 99%

3D Photon-To-Digital Converter for Radiation Instrumentation: Motivation and Future Works

Pratte

Nolet

Parent

et al. 2021

Sensors

View full text Add to dashboard Cite

show abstract

“…However electrical interconnections have not been implemented in both technologies. As far as electrical connections are considered, the idea is to leverage current developments performed on thin glass substrates for the high bandwidth memories (HBM) market [8]. The pending challenge is therefore to develop cost effective optical interconnections embedded in the glass substrate comprising single mode waveguides and slanted mirrors for the vertical redirection of the beam towards the PIC that is compatible with the fabrication process of electrical redistribution layers on thin glass substrates for HBM.…”

Section: Introductionmentioning

confidence: 99%

Cost Effective Laser Structuration of Optical Waveguides on Thin Glass Interposer

Boucaud

Ayi-Yovo

Hivin

et al. 2017

J. Lightwave Technol.

View full text Add to dashboard Cite

In order to enhance electro-optical system-inpackage capabilities for silicon photonics, a cost effective fabrication process for optical waveguides integration on thin glass substrate interposer is demonstrated. First, a femtosecond laser ablation coupled with a hydrofluoric acid etching is developed to create microgrooves at the glass surface. Second, a dry film lamination followed by chemical mechanical planarization is achieved to define surface optical waveguides by filling the microchannels. Physical characterizations of the fabricated waveguides are performed using optical and scanning electron microscopy. Finally, optical mode profile and loss characterizations confirm the optical functionality of waveguides which prove to be multimodal at 1550 nm.

show abstract

New signal skew cancellation method for 2 Gbps transmission in glass and organic interposers to achieve 2.5D package employing next generation high bandwidth memory (HBM)

Kariyazaki

Kuboyama

Oikawa

et al. 2015

2015 International 3D Systems Integration Conference (3DIC)

View full text Add to dashboard Cite

Design and demonstration of large 2.5D glass interposer for high bandwidth applications

Cited by 7 publications

References 4 publications

3D Photon-To-Digital Converter for Radiation Instrumentation: Motivation and Future Works

3D Photon-To-Digital Converter for Radiation Instrumentation: Motivation and Future Works

Cost Effective Laser Structuration of Optical Waveguides on Thin Glass Interposer

New signal skew cancellation method for 2 Gbps transmission in glass and organic interposers to achieve 2.5D package employing next generation high bandwidth memory (HBM)

Contact Info

Product

Resources

About