Design and development of automatic visual inspection system for PCB manufacturing

Abstract

a b s t r a c tInspection of solder joints has been a critical process in the electronic manufacturing industry to reduce manufacturing cost, improve yield, and ensure product quality and reliability. This paper proposes two inspection modules for an automatic solder joint classification system. The ''front-end'' inspection system includes illumination normalisation, localisation and segmentation. The ''back-end'' inspection involves the classification of solder joints using the Log-Gabor filter and classifier fusion. Five different levels of solder quality with respect to the amount of solder paste have been defined. The Log-Gabor filter has been demonstrated to achieve high recognition rates and is resistant to misalignment. This proposed system does not need any special illumination system, and the images are acquired by an ordinary digital camera. This system could contribute to the development of automated non-contact, non-destructive and low cost solder joint quality inspection systems.

How and why we need to capture tacit knowledge in manufacturing: Case studies of visual inspection

“…A great deal of literature from research studies has examined VI in manufacturing contexts, and more recently in relation to the development of new automated inspection systems (e.g. Golnabi and Asadpour, 2007;Lin, 2007;Lyu and Chen, 2009;Kumar and Kannan, 2010;Sun, et al, 2010;Mar, et al, 2011;Ravikumar, et al, 2011;Sun, et al, 2012;Huang and Pan, 2015;Mumtaz, et al, 2012;Caggiano, et al, 2015). There appears to have been little or no dedicated exploration of tacit knowledge in these various studies.…”

Automatic Defect Inspection for Coated Eyeglass Based on Symmetrized Energy Analysis of Color Channels

“…AOI has been increasingly used for automatic defect detection in industry product quality control. One mature application of AOI is the inspection of the printed circuit board [1][2][3][4]. Recently, the use of AOI-based defect inspection systems has been extended to several industries, such as steel [5][6][7][8][9][10], textile and garment [11][12][13], solar cells [14][15][16][17][18], plastic [19,20], and liquid crystal display (LCD) [21][22][23][24] [ [21][22][23][24] industries.…”

Detection of ball grid array solder joints based on adaptive template matching

“…Over the years, many image segmentation methods have been developed to extract BGA solder joints from the X-ray images of printed circuit board (PCB), such as threshold segmentation and edge extraction, to name but a few [5][6][7][8][9][10][11][12]. The X-ray technique is adopted because it is impossible to find the defects in visible light.…”