2007 International Workshop on Physics of Semiconductor Devices 2007
DOI: 10.1109/iwpsd.2007.4472604
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Design and development of passive and active RF Components using MEMS technology

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Cited by 3 publications
(3 citation statements)
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“…The prototype will be measured using E8362B Agilent network analyzer. A composite LPF has been designed using microstrip line and fabricated by using MEMS technology [22][23]. The sharpness of the cutoff from the simulations is larger compared to the fabricated prototype composite LPF.…”
Section: Ads Results and Simulationsmentioning
confidence: 99%
See 1 more Smart Citation
“…The prototype will be measured using E8362B Agilent network analyzer. A composite LPF has been designed using microstrip line and fabricated by using MEMS technology [22][23]. The sharpness of the cutoff from the simulations is larger compared to the fabricated prototype composite LPF.…”
Section: Ads Results and Simulationsmentioning
confidence: 99%
“…MEMS technology is capable of producing devices that have the dimensions in the sub-millimeter range and enable the production of better filter frequency response which will fulfill the design requirement. MEMS technology [18][19][20][21][22][23] can even integrate these Composite low pass filters to replace the low-impedance transmission line in a stepped impedance filter to be included in multi-chip packages or in an integrated circuit form.…”
Section: Introductionmentioning
confidence: 99%
“…However such methods tend to be of quite limited versatility and the trend now is toward selective removal of substrate in the vicinity of the antenna. This can be done by, for example, bulk micromachining an air gap between the planar antenna (usually a conducting patch) and the ground plane (Koul, 2007). The advantages of doing so are as follows:…”
Section: Introductionmentioning
confidence: 99%