Semiconductor materials are currently one of the most core materials in the worlds high-tech industry, and the research and development of semiconductor materials is related to the improvement of human technological level. This paper presents a comparative study of Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) and High Electron Mobility Transistors (HEMTs), two pivotal components in electrical engineering, each with unique characteristics and functions. Despite structural similarities, MOSFETs and HEMTs differ significantly in operation and conduction methods. MOSFETs rely on an inversion layer formed at the semiconductor-oxide interface, controlled by gate voltage, for electron conduction. Conversely, HEMTs utilize a two-dimensional electron gas (2DEG) at the interface of materials like Gallium Nitride and Aluminum Gallium Nitride, offering high electron mobility crucial for performance. Both share similar I-V characteristics but differ in performance under various conditions. MOSFETs are cost-effective, ideal for mass production and general applications, while HEMTs excel in stability and performance in extreme conditions, suitable for high-performance needs. This study underscores the importance of selecting the right component based on application-specific requirements, highlighting MOSFETs for cost-efficiency and HEMTs for challenging environments. This article will provide some guidance for the research of MOSFET and HEMT.