Design and fabrication of a novel superhydrophobic surface based on a copolymer of styrene and bisphenol A diglycidyl ether monoacrylate

Liu, Jinqiu; Bai, Chong; Jia, Dedong; Liu, Weiliang; He, Fuyan; Liu, Qinze; Yao, Jinshui; Wang, Xinqiang; Wu, Yongzhong

doi:10.1039/c4ra01505c

Cited by 20 publications

(17 citation statements)

References 42 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Bisphenol A diglycidyl ether, often called as bisphenol A type epoxy resin, is the first commercialized and still most widely used epoxy resin. Synthesis of DGEBA is illustrated in Figure 1 [12]. In volume base, it is estimated that over 75% of epoxy resin used in industry is this type.…”

Section: Epoxy Adhesive Chemistrymentioning

confidence: 99%

Epoxy Adhesives

Chen¹,

Li²,

Kanari³

et al. 2019

Adhesives and Adhesive Joints in Industry Applications

View full text Add to dashboard Cite

Epoxy adhesives are primarily composed of epoxy resin and curing agent. Epoxy adhesives are supplied in both one-component package and two-component package depending on curing agent used and curing method applied. Two-component epoxy adhesives are prepared by packing epoxy composition and curing agent composition separately. They cure soon after mixing the two components together. Almost all room temperature cure epoxy adhesives are supplied in two-component package. One-component epoxy adhesives are prepared and supplied by mixing all formulated components in advance including epoxy resin and curing agent. One-component epoxy adhesives usually need cure at elevated temperature and store at low temperature in a refrigerator or even freezer. Epoxy adhesives have been widely used as typical reactive adhesives for various applications ranging from general industry, construction, electronics assembly, automobile production to aerospace market. Typical room temperature cure epoxy adhesives, thermal cure epoxy adhesives and UV cure epoxy adhesives are introduced in detail.

show abstract

Section: Epoxy Adhesive Chemistrymentioning

confidence: 99%

Epoxy Adhesives

Chen¹,

Li²,

Kanari³

et al. 2019

Adhesives and Adhesive Joints in Industry Applications

View full text Add to dashboard Cite

show abstract

“…2c) could be ascribed to the benzene ring. 35,36 These silica particles were identied as PS-HSNs, suggesting that a small fraction of the vinyl groups on the particle surface had been replaced by phenyl groups. However, other signals related to benzene could not be identied in the spectrum, probably due to the relatively low gra ratio.…”

Section: Modication Of Hsnsmentioning

confidence: 99%

Facile synthesis of a superhydrophobic surface with modified hollow silica nanoparticles

Wang

Zhou

et al. 2014

RSC Adv.

Self Cite

View full text Add to dashboard Cite

“…The highly functional sorbitol glycidyl ethers are widely used as epoxy monomers. In general, they enhance cross‐linking densities paralleled by an improved performance as adhesives, coatings and electrical insulations 3 …”

Section: Introductionmentioning

confidence: 99%

Improving thermal and flame retardant properties of sorbitol‐based bioepoxy systems by phosphorus‐based flame retardants

2021

View full text Add to dashboard Cite

Summary Flame‐retarded sorbitol‐based bioepoxy resins cured with cycloaliphatic amine hardener and containing different commercially available additive‐type flame retardants (FRs) have been prepared. Three different oxidation states of phosphorus, aluminium diethyl phosphinate (AlPi) (+1), phosphonate polyol (+3), ethyl ethylene glycol phosphate and ammonium polyphosphate (APP) (+5), have been studied. The effect of using melamine cyanurate with APP and AlPi has been assessed. The self‐extinguishing V‐0 rating according to UL‐94 flammability standard tests and very good limiting oxygen index for combustion are displayed for most flame‐retarded samples at 3 wt% phosphorus content. The flame retardancy effect for the additives was confirmed using cone calorimetry. The samples containing MC with APP at 3%P content showed a dramatic reduction of the total heat release by 60% and reduction of the peak of heat release rate by 70% compared to the reference epoxy matrix. The addition of these FRs together did not decrease the glass transition temperature significantly.

show abstract

Design and fabrication of a novel superhydrophobic surface based on a copolymer of styrene and bisphenol A diglycidyl ether monoacrylate

Abstract: PS-co-AADGEBA was synthesized and used to fabricate superhydrophobic surfaces. It was then grafted onto amino-functionalized hollow silica nanospheres to generate a nanocomposite superhydrophobic surface.

Cited by 20 publications

References 42 publications

Epoxy Adhesives

Epoxy Adhesives

Facile synthesis of a superhydrophobic surface with modified hollow silica nanoparticles

Improving thermal and flame retardant properties of sorbitol‐based bioepoxy systems by phosphorus‐based flame retardants

Contact Info

Product

Resources

About