Design and Fabrication of a Novel Poly-Si Microhotplate with Heat Compensation Structure

Abstract

I Microhotplates are critical devices in various MEMS sensors that could provide appropriate operating temperatures. In this paper, a novel design of poly-Si membrane microhotplates with a heat compensation structure was reported. The main objective of this work was to design and fabricate the poly-Si microhotplate, and the thermal and electrical performance of the microhotplates were also investigated. The poly-Si resistive heater was deposited by LPCVD, and phosphorous doping was applied by in situ doping process to reduce the resistance of poly-Si. In order to obtain a uniform temperature distribution, a series of S-shaped compensation structures were fabricated at the edge of the resistive heater. LPCVD SiNx layers deposited on both sides of poly-Si were used as both the mechanical supporting layer and the electrical isolation layer. The Pt electrode was fabricated on the top of the microhotplate for temperature detection. The area of the heating membrane was 1 mm × 1 mm. Various parameters of the different size devices were simulated and measured, including temperature distribution, power consumption, thermal expansion and response time. The simulation and electrical–thermal measurement results were reported. For microhotplates with a heat compensation structure, the membrane temperature reached 811.7 °C when the applied voltage was 5.5 V at a heating power of 148.3 mW. A 3.8 V DC voltage was applied to measure the temperature distribution; the maximum temperature was 397.6 °C, and the area where the temperature reached 90% covered about 73.8% when the applied voltage was 3.8 V at a heating power of 70.8 mW. The heating response time was 17 ms while the microhotplate was heated to 400 °C from room temperature, and the cooling response time was 32 ms while the device was recovered to room temperature. This microhotplate has many advantages, such as uniform temperature distribution, low power consumption and fast response, which are suitable for MEMS gas sensors, humidity sensors, gas flow sensors, etc.

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“…After drying in a vacuum at 70 °C, the slurry was sintered and aged at 600 °C for 12 h. The heating rate was controlled at 5 °C/min. The fabrication process of the micro hot plates was described in detail in the previous study . The individual sensor chips were mounted on the TO-5 packages, and the contact pads of the chips were bonded to the package pins with Au wires by using a wire bonder.…”

“…The fabrication process of the micro hot plates was described in detail in the previous study. 46 The individual sensor chips were mounted on the TO-5 packages, and the contact pads of the chips were bonded to the package pins with Au wires by using a wire bonder. The MEMS gas sensor is shown in Figure S1a.…”