Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV)

Abstract

This paper presents the integration of WLAN (2.4 and 5GHz) bandpass filters in glass interposer using throughpackage vias. The filters include novel embedded passive components such as stitched capacitors with reduced shunt parasitics and via-based inductors that provide area reduction. The filters designed for 2.4 GHz showed an insertion loss of less than 2dB and better than 15dB return loss, while the 5GHz filters showed an insertion loss of less than 1dB with better than 20dB return loss. Stop-band rejection of over 35dB was observed at 2.2 GHz on the 2.4 GHz bandpass filters. The measured results showed good agreement with the simulated values and indicated that the performance on glass interposer closely matches the performance of the more expensive high resistivity silicon with similar properties.

Demonstration of 3–5 μm RDL line lithography on panel-based glass interposers

“…Figure 1 shows the schematic of the proposed 2.5D glass interposer.. Glass has dimensional and thermal stabilities very similar to silicon as well surface smoothness to form ultra-small wiring traces, but superior in electrical performance than silicon due to its low loss and ultra-high resistivity, and in cost, due to very large area (8X) processability [1][2][3]. The insertion loss of TPVs in glass is lower than in traditional silicon interposers.…”

“…The insertion loss of TPVs in glass is lower than in traditional silicon interposers. Modeling, design and fabrication of ultra-thin glass interposers with fine pitch through-package-vias (TPVs) have been successfully demonstrated [1][2][3][4]. However, ultra-fine pitch and low cost RDL layers on glass interposers have not been demonstrated.…”

Research on Wafer-Level MEMS Packaging with Through-Glass Vias

“…There are many ways to achieve electrical interconnection, such as through-silicon via (TSV) technology, silicon on insulator (SOI) technology, glass-in-silicon (GIS) technology, and diffusion resistance technology [1,2]. TGV technology is also used for interconnection [3,4]. There are various bonding technologies, such as eutectic bonding, thermal bonding, direct bonding, and anodic bonding.…”

Millimeter-Wave Substrate Integrated Waveguide Using Micromachined Tungsten-Coated Through Glass Silicon Via Structures

“…Recently, glass interposers based on the through glass via (TGV) technology have been extensively studied as an alternative for the silicon interposers [ 3 , 4 , 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 ]. Glass, as a substrate material, has several merits; closely matched CTE to silicon dies, high dimensional stability and availability in thin and large panels.…”

“…Especially, the high signal isolation, low substrate loss and low material and manufacturing cost of the glass compared to conventional silicon wafers make the glass interposers attractive platforms for high frequency radio frequency (RF)/microwave passive components and packaging. Different types of RF components based on the glass interposers with TGVs such as filters [ 4 ], 3D inductors [ 8 , 9 ] and antennas [ 13 , 14 ] have been reported.…”