2006
DOI: 10.1109/ted.2006.871174
|View full text |Cite
|
Sign up to set email alerts
|

Design and fabrication of high-performance polycrystalline silicon thin-film transistor circuits on flexible steel foils

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
24
0
2

Year Published

2007
2007
2016
2016

Publication Types

Select...
7
2

Relationship

0
9

Authors

Journals

citations
Cited by 36 publications
(26 citation statements)
references
References 18 publications
0
24
0
2
Order By: Relevance
“…polyimide). [30] Although these approaches can yield transistors with impressive properties, [31][32][33][34][35][36][37] the procedures are complex and will require sophisticated setups to implement over large areas with suitable levels of uniformity. A different and more recent technique involves the incorporation of single-crystal inorganic semiconductors directly, in the form of separately synthesized micro-or nanoscale structures.…”
Section: Summary and Outlook 5539mentioning
confidence: 99%
“…polyimide). [30] Although these approaches can yield transistors with impressive properties, [31][32][33][34][35][36][37] the procedures are complex and will require sophisticated setups to implement over large areas with suitable levels of uniformity. A different and more recent technique involves the incorporation of single-crystal inorganic semiconductors directly, in the form of separately synthesized micro-or nanoscale structures.…”
Section: Summary and Outlook 5539mentioning
confidence: 99%
“…[28][29][30][31][32][33]. We selected the simplest circuit interface based on RO made by low temperature n-channel polysilicon thin film Transistor (PS-nTFT) directly integrated on PI [34][35][36].…”
Section: Sensors Units Designmentioning
confidence: 99%
“…When it comes to the quality of a TFT on flexible substrate, the objective is often to elevate the device performance to a level similar to a geometrically identical TFT on rigid substrate. This is in fact a rather challenging task which requires extensive experiments with various substrate materials to manage the best surface quality and CTE compatibility, rigorous examination with different passivation materials as the isolation and barrier coating to prevent out-diffusion and shorting issues, and also careful determination of deposition conditions and parameters of thin films to control the stress build-up [12].…”
Section: Tft On Stainless Steel Foilmentioning
confidence: 99%