Design and fabrication of micro heat flux sensor

Chun, Jaechul; Oh, SH; Lee, S.S.; Kim, Moo-Hwan

doi:10.1109/iros.1999.812818

Cited by 7 publications

(7 citation statements)

References 5 publications

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“…Compared with the previous results [8], the sensitivity and linearity is improved in the modified sensor, however it is expected that further research will be done in the sensor design, the fabrication process, and the metal pair of the thermocouple junction.…”

Section: Test and Discussionmentioning

confidence: 69%

“…In this study, we chose a convective calibration method since the convective heat transfer environment is the most frequent situation. The method chosen was used, and is described in detail, for our previous heat flux sensor [8]. Figure 7 shows photographs of the experimental set-up of the small wind tunnel and test section where convective heat transfer occurs.…”

Section: Test and Discussionmentioning

confidence: 99%

“…Figure 3 shows the cross section and the top view of our previous bulk-micromachined micro heat flux sensor which can measure the heat flux from the wall with only a small disturbance [8]. The heat flux from the wall is transferred to the sensor through the contact layer of gold (Au), and flows out to the environment producing temperature difference along the thermal path of Au, A→B→C→D→E.…”

Section: Device and Fabricationmentioning

confidence: 99%

“…Since the heat flux sensor may work as a heat resistance in itself, it may disturb heat flow to produce incorrect heat flux information. Thus some research has been conducted to reduce the size of the sensor with MEMS technology in order to reduce the effect of the sensors [7,8].…”

Section: Introductionmentioning

confidence: 99%

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Micro heat flux sensor using copper electroplating in SU-8 microstructures

Lee

Chun

et al. 2001

J. Micromech. Microeng.

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A micro heat flux sensor which can measure the thermal energy transfer per unit area has been designed, fabricated, and calibrated in a convective environment. The sensor which is based on a circular foil gage is composed of thermal paths and a thermopile. The thermal path is made in a LIGA-like process of SU-8 high aspect ratio microstructures and electroplated copper layers. The thermopile, a series of thermocouples, is used to amplify the output signal as a thermometer. When the sensor is placed on a high-temperature wall, heat flux from the wall flows through thermal paths and drains out to the environment, producing a temperature difference along its paths. Heat flux is obtained by calibrating this temperature difference in the thermopile of Ni-Cr or Al-Chromel pairs. The sensitivity of the heat flux sensor of Ni-Cr and Al-Chromel pairs is in the range of 0.1-2.0 and 0.4-2.0 µV mW −1 cm −2 , respectively, in the heat flux range of 0-180 mW cm −2 .

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Section: Test and Discussionmentioning

confidence: 69%

Section: Test and Discussionmentioning

confidence: 99%

Section: Device and Fabricationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Micro heat flux sensor using copper electroplating in SU-8 microstructures

Lee

Chun

et al. 2001

J. Micromech. Microeng.

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“…A heat flux sensor is a device that measures the amount of thermal energy per time transferred through a given area [19]. Sensor designs are generally categorized as using one of the following methods: transient, active heating and gradient [20]. The history, performance, design characteristics, and application of heat flux sensors in research and industry are well documented [21][22][23].…”

Section: Introductionmentioning

confidence: 99%

Thin film heat flux sensors fabricated on copper substrates for thermal measurements in microfluidic environments

Jasperson

Schmale

et al. 2014

J. Micromech. Microeng.

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Micro-scale heat flux sensors are fabricated on bulk copper surfaces using a combination of lithography-based microfabrication and micro end milling. The heat flux sensors are designed to enable heat transfer measurements on an individual pin in a copper micro pin fin heat sink. Direct fabrication of the sensors on copper substrates minimizes the thermal resistance between the sensor and pin. To fabricate the devices, copper wafers were polished to a flatness and roughness suitable for microfabrication and standard processes, including photolithography, polyimide deposition via spinning, and metal deposition through physical vapor deposition were tailored for use on the unique copper substrates. Micro end milling was then used to create 3D pin features and segment the devices from the copper substrate. Temperature calibrations of the sensors were performed using a tube furnace and the heat flux sensing performance was assessed through laser-based tests. This paper describes the design, fabrication and calibration of these integrated heat flux sensors.

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A novel temperature based flat-plate heat flux sensor for high accuracy measurement

Liu

et al. 2009

2009 IEEE/ASME International Conference on Advanced Intelligent Mechatronics

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Design and fabrication of micro heat flux sensor

Cited by 7 publications

References 5 publications

Micro heat flux sensor using copper electroplating in SU-8 microstructures

Micro heat flux sensor using copper electroplating in SU-8 microstructures

Thin film heat flux sensors fabricated on copper substrates for thermal measurements in microfluidic environments

A novel temperature based flat-plate heat flux sensor for high accuracy measurement

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