Design and FEM simulation for a novel resonant silicon MEMS gyroscope with temperature compensation function

Zhang, Guo; Fu, Peng Qiang; Liu, Defeng; Huang, Manguo

doi:10.1007/s00542-017-3524-4

Cited by 12 publications

(8 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Meanwhile, the outside environmental instability, such as packaging stress, temperature variations, and shock environments [8,9], is another main cause of its frequency drift. On this occasion, well-designed materials and structures with opposite temperature-related characteristics are often used for temperature compensation in practical gyroscope manufacturing [10,11], but these methods are inapplicable to most gyroscopes. For another, the drive frequency (f drive ) can be used as a temperature indicator for the first-order temperature compensation, and thus a sub-degree-per-hour bias stability (1σ) is attained [12].…”

Section: Introductionmentioning

confidence: 99%

ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release

Wei

Jia

et al. 2021

Micromachines

View full text Add to dashboard Cite

Zero-rate output (ZRO) drift induces deteriorated micro-electromechanical system (MEMS) gyroscope performances, severely limiting its practical applications. Hence, it is vital to explore an effective method toward ZRO drift reduction. In this work, we conduct an elaborate investigation on the impacts of the internal and packaging stresses on the ZRO drift at the thermal start-up stage and propose a temperature-induced stress release method to reduce the duration and magnitude of ZRO drift. Self-developed high-Q dual-mass tuning fork gyroscopes (TFGs) are adopted to study the correlations between temperature, frequency, and ZRO drift. Furthermore, a rigorous finite element simulation model is built based on the actual device and packaging structure, revealing the temperature and stresses distribution inside TFGs. Meanwhile, the relationship between temperature and stresses are deeply explored. Moreover, we introduce a temperature-induced stress release process to generate thermal stresses and reduce the temperature-related device sensitivity. By this way, the ZRO drift duration is drastically reduced from ~2000 s to ~890 s, and the drift magnitude decreases from ~0.4 °/s to ~0.23 °/s. The optimized device achieves a small bias instability (BI) of 7.903 °/h and a low angle random walk (ARW) of 0.792 °/√ h, and its long-term bias performance is significantly improved.

show abstract

Section: Introductionmentioning

confidence: 99%

ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release

Wei

Jia

et al. 2021

Micromachines

View full text Add to dashboard Cite

show abstract

“…For one thing, the gyroscope's resonant frequency is susceptive to its generated heats and environmental fluctuations due to its temperature-sensitive inherent frequency. On this occasion, welldesigned materials and structures with opposite temperature-related characteristics are often used for temperature compensation in practical gyroscope manufacturing [7,8]. For another, the drive frequency can be used as a temperature indicator for the first-order temperature compensation, and thus a sub-degree-per-hour bias stability (1) is attained [9].…”

Section: Introductionmentioning

confidence: 99%

ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release

Xu¹,

Wei²,

Jia³

et al. 2021

Preprint

View full text Add to dashboard Cite

Zero-rate output (ZRO) drift induces deteriorated micro-electromechanical system (MEMS) gy-roscope performances, severely limiting its practical applications. Hence, it is vital to explore an effective method toward ZRO drift reduction. In this work, we conduct an elaborate investigation on the impacts of the internal and packaging stresses on the ZRO drift at the thermal start-up stage, and propose a temperature-induced stress release method to reduce the duration and magnitude of ZRO drift. Self-developed high-Q dual mass tuning fork gyroscopes (TFGs) are adopted to study the correlations between temperature, frequency and ZRO drift. Furthermore, a rigorous finite element simulation model is built based on the actual device and packaging structure, revealing the temperature and stresses distribution inside TFGs. Meanwhile, the relationship between temperature and stresses are deeply explored. Moreover, we introduce a temperature-induced stress release process to generate thermal stresses and reduce the temperature-related device sensitivity. By this way, the ZRO drift duration is drastically reduced from ~2000 s to ~890 s, and the drift magnitude decreases from ~0.4 °/s to ~0.23 °/s. This stress release method achieves a small bias instability (BI) of 7.903 °/h and a low angle random walk (ARW) of 0.792 °/√h, and the long-term bias performance is significantly improved.

show abstract

“…The high-temperature values may lead to stiffness degradation of the mechanical springs, variations in the air damping force and misalignment of the sensing parallel plates in electrostatic MEMS devices due to thermal expansion. Generally, for the MEMS gyroscopes, different temperature compensation techniques are implemented after the fabrication for reliable operation [ 25 , 26 ], which results in added complexity. Thus, both the selection of thermally stable material for the fabrication of MEMS gyroscope and structural design optimization considering the temperature effects must be considered at the design level.…”

Section: Introductionmentioning

confidence: 99%

Microfabrication Process-Driven Design, FEM Analysis and System Modeling of 3-DoF Drive Mode and 2-DoF Sense Mode Thermally Stable Non-Resonant MEMS Gyroscope

et al. 2020

View full text Add to dashboard Cite

This paper presents microfabrication process-driven design of a multi-degree of freedom (multi-DoF) non-resonant electrostatic microelectromechanical systems (MEMS) gyroscope by considering the design constraints of commercially available low-cost and widely-used silicon-on-insulator multi-user MEMS processes (SOIMUMPs), with silicon as a structural material. The proposed design consists of a 3-DoF drive mode oscillator with the concept of addition of a collider mass which transmits energy from the drive mass to the passive sense mass. In the sense direction, 2-DoF sense mode oscillator is used to achieve dynamically-amplified displacement in the sense mass. A detailed analytical model for the dynamic response of MEMS gyroscope is presented and performance characteristics are validated through finite element method (FEM)-based simulations. The effect of operating air pressure and temperature variations on the air damping and resulting dynamic response is analyzed. The thermal stability of the design and corresponding effect on the mechanical and capacitive sensitivity, for an operating temperature range of −40 °C to 100 °C, is presented. The results showed that the proposed design is thermally stable, robust to environmental variations, and process tolerances with a wide operational bandwidth and high sensitivity. Moreover, a system-level model of the proposed gyroscope and its integration with the sensor electronics is presented to estimate the voltage sensitivity under the constraints of the readout electronic circuit.

show abstract

Design and FEM simulation for a novel resonant silicon MEMS gyroscope with temperature compensation function

Cited by 12 publications

References 8 publications

ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release

ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release

ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release

Microfabrication Process-Driven Design, FEM Analysis and System Modeling of 3-DoF Drive Mode and 2-DoF Sense Mode Thermally Stable Non-Resonant MEMS Gyroscope

Contact Info

Product

Resources

About