2021 Symposium on Design, Test, Integration &Amp; Packaging of MEMS and MOEMS (DTIP) 2021
DOI: 10.1109/dtip54218.2021.9568685
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Design and Finite Element Analysis of an Electrothermally Actuated Microgripper for Biomedical Applications

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Cited by 5 publications
(3 citation statements)
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“…Very often, electrothermally activated MEMS design engineers resort to virtually characterising devices using finite element solvers, wherein heat lost by the device via convection is either completely omitted or applied simply as a constant boundary condition [ 45 , 46 , 47 ]. Other methods assume that convection can be replaced by conduction to the substrate [ 48 , 49 , 50 ]. While these assumptions may suffice in simpler scenarios such as operation in still air, their suitability is questionable for more complex functions where the device may be submerged in highly conductive, viscous fluids and/or where the device may be exposed to fluid flow where the significance of FSI is quantifiable.…”
Section: Numerical Modellingmentioning
confidence: 99%
“…Very often, electrothermally activated MEMS design engineers resort to virtually characterising devices using finite element solvers, wherein heat lost by the device via convection is either completely omitted or applied simply as a constant boundary condition [ 45 , 46 , 47 ]. Other methods assume that convection can be replaced by conduction to the substrate [ 48 , 49 , 50 ]. While these assumptions may suffice in simpler scenarios such as operation in still air, their suitability is questionable for more complex functions where the device may be submerged in highly conductive, viscous fluids and/or where the device may be exposed to fluid flow where the significance of FSI is quantifiable.…”
Section: Numerical Modellingmentioning
confidence: 99%
“…More details regarding the simulation works and sensitivity analysis of the capacitive readout were previously reported by the authors [13].…”
Section: Comparison Between the Performances Of The Microgripper The ...mentioning
confidence: 99%
“…This problem can be handled by adding heat sink beams [10][11][12] to dissipate the heat to the surrounding fluid or the device frame. In the case of a MEMSbased gripping platform, heat sink beams can be placed in cascade with the actuator to provide temperature reduction towards the grippers, as proposed by the authors in a previous study [13].…”
Section: Introductionmentioning
confidence: 99%