Design and implementation of a rigid-flex RF front-end system-in-package

Wu, Pei-Ming; Liu, Fengman; Li, Jun; Chen, Cheng; Hou, Fengze; Cao, Liqiang; Wan, Lixi

doi:10.1007/s00542-016-3141-7

Cited by 8 publications

(1 citation statement)

References 20 publications

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“…Vias also improve the thermal performance, so adding grounded vias around the stacked chips is a good option. The heat is transferred to the metal layer through the vias and then dissipated using air cooling or convection [ 98 ]. The thermal dependability of the packing system can also be impacted by factors including the filling material, diameter, thickness, and spacing of the TVSs [ 99 ].…”

Section: Sip Reliability Optimization Solutionmentioning

confidence: 99%

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Wang

Yang

et al. 2023

Micromachines

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The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors—thermal management, mechanical stress and electrical properties—can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package.

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Section: Sip Reliability Optimization Solutionmentioning

confidence: 99%