2009
DOI: 10.1088/0960-1317/19/7/074019
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Design and measurement of stress indicator structures for the characterization of Epoclad negative photoresist

Abstract: Using new materials for the structural or active layers in MEMS requires the knowledge of the material properties. In this paper, the internal stress and the coefficient of thermal expansion of Epoclad negative photoresist are measured. Despite being a photoresist, the epoxy-based material has very good mechanical properties. It enables the creation of microscale mechanical structures using this material. The internal stress and the coefficient of thermal expansion were measured using on-wafer stress indicator… Show more

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Cited by 10 publications
(9 citation statements)
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“…For our sensor, the thermo-optic coefficient of the EpoCore is −71 ppm/K [13], but no manufacturer data about the coefficient of thermal expansion of EpoCore and EpoClad exist, and rare values from literature differ strongly. While Wouters and Puers approximated the CTE of EpoClad to be in the range of 80 ± 10 ppm/K [30], Shi calculated the CTE of EpoCore to be 20-30 ppm/K [31], but obtained this result from a sensor on a glass substrate. Nevertheless, we assume that the dominant thermal expansion is caused by the COP substrate with a CTE of 60 ppm/K, thus we would expect a temperature sensitivity of −11 ppm/K.…”
Section: Influence Of Temperaturementioning
confidence: 99%
“…For our sensor, the thermo-optic coefficient of the EpoCore is −71 ppm/K [13], but no manufacturer data about the coefficient of thermal expansion of EpoCore and EpoClad exist, and rare values from literature differ strongly. While Wouters and Puers approximated the CTE of EpoClad to be in the range of 80 ± 10 ppm/K [30], Shi calculated the CTE of EpoCore to be 20-30 ppm/K [31], but obtained this result from a sensor on a glass substrate. Nevertheless, we assume that the dominant thermal expansion is caused by the COP substrate with a CTE of 60 ppm/K, thus we would expect a temperature sensitivity of −11 ppm/K.…”
Section: Influence Of Temperaturementioning
confidence: 99%
“…In particular, this enables us to quantify the volume change of the epoxy due to the absorption or desorption of a liquid. The working principle is relatively simple, see figure 1 [17]. When the test beams are freestanding, they will relax their built-in stress and move the amplification beam.…”
Section: The Used Stress Indicator Structurementioning
confidence: 99%
“…7. For the rest of this work, we have selected these materials for several additional reasons as well: • Improved thermal stability as the oxides have a much lower thermal expansion coefficient (0.55 ppm/K for silicon oxide vs 87±10 ppm/K for EpoClad [43]).…”
Section: Silicon Oxide-silicon Oxynitride Planar Waveguidesmentioning
confidence: 99%