Design and performance of a high density 3D microwave module

Sturdivant, Rick; Ly, Chung; Benson, J. D.; Hauhe, M.

doi:10.1109/mwsym.1997.602841

Cited by 26 publications

(9 citation statements)

References 3 publications

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“…System-in-package (SiP) technology, based on the concept of integrating all of a system's electronic components into a single package, is growing rapidly as a highly efficient solution to the increasing demand for cost-effective, compact, and reliable RF modules [1]. A multilayer package substrate is usually made of high temperature cofired ceramic (HTCC), low temperature cofired ceramic (LTCC), thick film, thin film, or organic packaging [2][3][4]. HTCC is regarded as the lowest cost ceramic technology, but it suffers from a significantly higher insertion loss.…”

Section: Introductionmentioning

confidence: 99%

A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages

2016

International Journal of Antennas and Propagation

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This paper investigates a novel X-band microstrip-to-microstrip vertical via transition with matching pads loaded signal via. This design has been proposed for a multilayer substrate package. The matching pads, which are located in the center of the signal via on each ground layer, are adopted to further improve the impedance matching level and thus attain better signal transition performance. A physics-based equivalent circuit modeling approach has been employed for this research. The right angle MS-to-MS via transition was also designed using this technique. The simulatedS-parameters indicate that the match-pad design made a breakthrough in achieving an approximate −15 dB wide-band return loss reduction. The measuredS-parameter of MS-to-MS transition showed that return loss with the matching pads is better than that without the matching pads.

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Section: Introductionmentioning

confidence: 99%

A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages

2016

International Journal of Antennas and Propagation

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“…Also, the three-dimensional (3-D) integration approach is an emerging and very attractive option for these systems. However, current 3-D RF module integration is still based on low-density hybrid assembly technologies [2], [3]. In this paper, we present novel liquid crystal polymer (LCP) multilayer technologies, and stacking board technique using BGA as the candidates of choice for the 3-D integration of RF front-end modules up to 35 GHz.…”

mentioning

confidence: 99%

3-D-Integrated RF and Millimeter-Wave Functions and Modules Using Liquid Crystal Polymer (LCP) System-on-Package Technology

Tentzeris

Laskar

Papapolymerou

et al. 2004

IEEE Trans. Adv. Packag.

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“…Cavities provide also integration opportunity for MEMSs devices such as MEMS Switch. Passive components, off-chip matching networks, embedded filter and antenna are implemented directly into the SOP boards by using multilayer technology [7][8][9][10][11]. Standard BGA balls insure interconnection of this high density module with a mother board such as FR4 board.…”

Section: Comparison Of Substrate Propertiesmentioning

confidence: 99%

Multi-band RF and mm-wave design solutions for integrated RF functions in liquid crystal polymer system-on-package technology

Palazzari

Thompson²,

Papageorgiou³

et al.

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)

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Electronic packaging evolution involves systems, technology and material considerations. In this paper, we present a liquid crystal polymer (LCP) based multilayer packaging technology that is rapidly emerging as an ideal platform for low cost, multi-band and reconfigurable RF front-end module integration. LCP's very low water absorption (0.04%), low cost and high electrical performance makes it very appealing for RF applications. Here we describe main characteristics and real performance of LCP substrate, by means of several design examples. A Single-Input-SingleOutput (SISO) dual-band filter operating at ISM 2.4-2.5 GHz and UNII 5.15-5.85 GHz frequency bands, a dual polarization, dual frequency 2x1 antenna operating at 14 and 35 GHz, and a WLAN IEEE 802.11a compliant compact module (volume of 75x35x0.2 mm 3 ) have been fabricated on LCP substrate, showing the great potential of the System-OnPackage approach for 3D compact, multi-band and reconfigurable integrated RF and millimeter waves functions and modules. IntroductionMiniaturization, portability, cost and performance have been the driving force for the evolution of packaging and system-on-package (SOP) approach in RF, microwave and millimeter wave applications. Recent research shows SOP to be a more feasible and low cost solution than system-on-chip (SOC) approach [1]. Cost, electrical performance, integration density, and packaging compatibility are variables that are often at odds with each other in RF designs. Few material technologies are able address these considerations simultaneously. LTCC is a technology that has excellent electrical performance, dense multilayer integration, and good barrier properties, but it is relatively expensive compared to standard FR4. Most other substrate and packaging materials do not have low enough water absorption properties in tandem with multilayer construction capabilities to be considered for vertically integrated designs. Liquid crystal polymer (LCP) provides the all-in-one solution for such integration approach in terms of high quality dielectric for high performance multiband passive design, excellent substrate for heterogeneous SOP integration as well as for MEMS structures, enabling the implementation of multiband and reconfigurable modules.In this paper, we present the potential of LCP as the substrate as well as the packaging material for wireless applications. In the following sections, the LCP fabrication

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Design and performance of a high density 3D microwave module

Cited by 26 publications

References 3 publications

A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages

A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages

3-D-Integrated RF and Millimeter-Wave Functions and Modules Using Liquid Crystal Polymer (LCP) System-on-Package Technology

Multi-band RF and mm-wave design solutions for integrated RF functions in liquid crystal polymer system-on-package technology

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