Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics

Abstract

A novel high-efficiency cooling mini-channel heat-sink structure has been designed to meet the package technology demands of high power density laser diode array stacks. Thermal and water flowing characteristics have been simulated using the Ansys-Fluent software. Owing to the increased effective cooling area, this mini-channel heat-sink structure has a better cooling effect when compared with the traditional macro-channel heat-sinks. Owing to the lower flow velocity in this novel high efficient cooling structure, the chillers' water-pressure requirement is reduced. Meanwhile, the machining process of this high-efficiency cooling mini-channel heat-sink structure is simple and the cost is relatively low, it also has advantages in terms of high durability and long lifetime. This heat-sink is an ideal choice for the package of high power density laser diode array stacks.

Power Enhancement and Spot Homogenization Design for Arrayed Semiconductor Lasers

“…Fiber pump lasers have been widely applied in the fields of industrial processing, country defense, and medicine aesthetics due to high power and spot homogenization [ 1 , 2 , 3 , 4 ]. For a typical semiconductor laser chip, the large difference between its fast-axis divergence angle (20~60°) and slow-axis divergence angle (6~20°) results in a low proportion of the beam focused into the fiber, which affects the optical performance of the laser [ 5 , 6 ]. To increase the power of the fiber laser, in addition to beam collimation of the fast and slow axes of the diode laser, the power of the fiber laser can be multiplied by increasing the number of diode lasers [ 7 , 8 , 9 ].…”