Design and Thermal Analysis of High Power LED Light

Abstract

In the development of lighting technologies, light emitting diode (LED) technology plays an important role due to its high efficiency. LED lighting is the future of indoor and outdoor illumination solutions that all around the world there is a widespread transition to save energy and have better quality illumination via LED-based solutions. On other hand, cooling of high power LED is crucial factor to utilize LED in high performance. In addition, finned heat sink could not be efficient based on the its geometry and usage areas due to the powder, the rain and the effects of the muds. In this study, an un-finned heat sink LED armature consisting of aluminum sheet metal was designed using a computer-aided-design (CAD) program. Furthermore, manufacturing of the heat sinks from sheet metal plates with bending machines enables to increase variety of LED armatures cheaply according to design requirements. Then, the thermal analysis of the system was conducted for the case of natural heat convection under different electrical powers and ambient temperatures by a commercial finite element analysis (FEA) program: SolidWorks Simulation. As a result of the thermal analysis, the ultimate heat sink sizes were obtained to minimize the junction temperature of LED. Finally, the experimental studies were carried out to verify the feasibility of numerical solutions that they were in good agreement.

Review on Thermal Analysis of LED Heat Power Dissipation and Efficiency Analysis.

“…Ultimately, the experimental research was done to confirm that the numerical solutions were feasible and that they agreed well. [7] 2) This review paper's objectives are to compile a range of thermal factors that impact high-power LED performance and to provide an overview of different cooling techniques that extend the lifespan and efficiency of LED lamps. We talk about thermal factors that are appropriate for high power LED packages, including thermal resistance, thermal spreading resistance, thermal interface material, thermal capacitance, and active and passive cooling systems.…”

Thermal management of multiple LEDs for high-power lighting applications

“…This optimization procedure involves an assessment of thermal characteristics, including thermal resistance and junction temperature, as outlined in previous works (Lai et al, 2017;Hwang et al, 2004;Zhang et al, 2022). Consequently, various configurations for arranging LEDs have been proposed as optimal designs (Abdelmlek et al, 2021;Lai et al, 2017;Rózowicz et al, 2022;Sümer et al, 2021). It is noteworthy, however, that a significant proportion of studies focusing on optimizing LED arrangements have primarily ascertained that LED temperature decreases as the distance between LEDs increases.…”