2020 IEEE 70th Electronic Components and Technology Conference (ECTC) 2020
DOI: 10.1109/ectc32862.2020.00289
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Design and Validation of Reliability Physics for Interconnect Architectures Induced from Inclusive TM/SM/EM Effects

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“…Therefore, we utilize display infrastructure to produce panel level flexible Cu redistributed layer (RDL), printed stretchable trace and further incorporate them into robust structure design to meet the requirements of FHE application. [3][4][5].…”
Section: Objective and Backgroundmentioning
confidence: 99%
“…Therefore, we utilize display infrastructure to produce panel level flexible Cu redistributed layer (RDL), printed stretchable trace and further incorporate them into robust structure design to meet the requirements of FHE application. [3][4][5].…”
Section: Objective and Backgroundmentioning
confidence: 99%
“…FHE researches and markets cover next generation smart city construction, smart medical, smart mobile, OLED, wearable devices, sports, and displays and so on. For example, aviation manufacturer Boeing, automobile industry leader BMW, mobile phone manufacturers Samsung and Apple, and other international manufacturers have devoted in the researches and designs for FHE technology, which showed the significant market opportunities and potential of FHE technology [2][3][4][5][6][7][8][9][10].…”
Section: Introductionmentioning
confidence: 99%