2015
DOI: 10.1016/j.sna.2015.09.023
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Design, fabrication and test of an integrated multi-microchannel heat sink for electronics cooling

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Cited by 24 publications
(4 citation statements)
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“…Çalışmalarda, bu bozulmaları azaltmak için sonlu elemanlar stres modeli geliştirilmiş, bu model sayesinde ısı transferi hakkında korelasyonlar türetilmiştir. Üretilen numunelerin mikro yapıları ve mekanik özellikleri incelenmiştir [18][19][20][21][22][23][24]. Kalıp çekirdeği üzerindeki soğutma kanallarının kalıba dökülen erimiş metalin sıcaklık değişimi üzerindeki etkisi gözlemlenirken, sıvı metalin katılaşma sürecini incelenmiştir.…”
Section: Sanayininunclassified
“…Çalışmalarda, bu bozulmaları azaltmak için sonlu elemanlar stres modeli geliştirilmiş, bu model sayesinde ısı transferi hakkında korelasyonlar türetilmiştir. Üretilen numunelerin mikro yapıları ve mekanik özellikleri incelenmiştir [18][19][20][21][22][23][24]. Kalıp çekirdeği üzerindeki soğutma kanallarının kalıba dökülen erimiş metalin sıcaklık değişimi üzerindeki etkisi gözlemlenirken, sıvı metalin katılaşma sürecini incelenmiştir.…”
Section: Sanayininunclassified
“…Compared with the conventional regular-sized channel heat sinks, microchannel heat sinks have been more widely used in the cooling, heat exchange, and thermal control modules of automation devices [7][8][9][10][11][12] due to their many merits such as high efficiency of heat exchange, energy-saving, and can make full use of the sensible and latent heat. Compared with air-cooled heat exchangers whose heat dissipation performance is greatly limited by the thermal and physical properties of the air, microchannel heat sinks have better heat transfer and isothermal performance [13][14][15][16][17][18][19][20][21][22][23][24]. To achieve higher efficiency of heat dissipation, the design of heat dissipation enhancement of automation systems from an overall optimization scale based on microchannel units has received more attention in both academic circle and the industry, and it is of great research value to explore the laws of enhanced heat dissipation in the microchannel units of automation systems.…”
Section: Introductionmentioning
confidence: 99%
“…The latest research shows that the heat flux up to 910 W/cm 2 is dissipated by a hierarchical manifold microchannel heat sink array [ 7 ]. Various structures of microchannel heat sinks are designed to find the optimization of its heat dissipation capacity, such as the single-layer (SL-MCHS) [ 8 ], double-layer (DL-MCHS), and multi-layer MCHS (ML-MCHS) [ 9 , 10 ], and great amounts of heat-transfer enhancement techniques are reported [ 11 , 12 , 13 ].…”
Section: Introductionmentioning
confidence: 99%