Design, fabrication and test of a bulk SiC MEMS accelerometer

Zhai, Yanxin; Li, Haiwang; Tao, Zhi; Cao, Xiaoda; Yang, Chunhui; Che, Zhizhao; Xu, Tiantong

doi:10.1016/j.mee.2022.111793

Cited by 24 publications

(10 citation statements)

References 17 publications

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“…[28]. As a MEMS metrology technique, this could see application in monitoring the performance of accelerometers, gyroscopes, and clocks over their lifetime and allows a fully depth sensitive means of device characterization [29,30,31]. The identification of device tethers as a center of stress concentration could contribute to improvements in quality factor via tether optimization [32].…”

Section: Discussionmentioning

confidence: 99%

Spin-Acoustic Control of Silicon Vacancies in 4H Silicon Carbide

Dietz¹,

Jiang²,

Bhave³

et al. 2022

Preprint

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We demonstrate direct, acoustically mediated spin control of naturally occurring negatively charged silicon monovacancies (V − Si ) in a high quality factor Lateral Overtone Bulk Acoustic Resonator fabricated out of high purity semi-insulating 4H-Silicon Carbide. We compare the frequency response of silicon monovacancies to a radio-frequency magnetic drive via optically-detected magnetic resonance and the resonator's own radio-frequency acoustic drive via optically-detected spin acoustic resonance and observe a narrowing of the spin transition to nearly the linewidth of the driving acoustic resonance. We show that acoustic driving can be used at room temperature to induce coherent population oscillations. Spin acoustic resonance is then leveraged to perform stress metrology of the lateral overtone bulk acoustic resonator, showing for the first time the stress distribution inside a bulk acoustic wave resonator. Our work can be applied to the characterization of high quality-factor micro-electro-mechanical systems and has the potential to be extended to a mechanically addressable quantum memory.

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Section: Discussionmentioning

confidence: 99%

Spin-Acoustic Control of Silicon Vacancies in 4H Silicon Carbide

Dietz¹,

Jiang²,

Bhave³

et al. 2022

Preprint

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“…24 Based on these sensing effects, different types of sensors have been developed, including mechanical sensor, 25 thermal sensor, 26 photodetector, 27 position detector, 28,29 and accelerometer. 30 Focusing on the piezoresistive effect, it detects the applied stress or strain by monitoring the resistance change. To do this, external voltage or current is traditionally used to power the sensor operation.…”

Section: Introductionmentioning

confidence: 99%

“…Unlike the polymorphs with high manufacturing cost, i.e., 4H-SiC and 6H-SiC, cubic silicon carbide (3C-SiC) can be easily grown on a Si substrate with high quality and low cost. , Therefore, 3C-SiC has been widely studied for its sensing effects, such as the piezoresistive effect, , thermoresistive effect, lateral photovoltaic effect, and vertical photovoltaic effect . Based on these sensing effects, different types of sensors have been developed, including mechanical sensor, thermal sensor, photodetector, position detector, , and accelerometer …”

Section: Introductionmentioning

confidence: 99%

Vertical Piezo-Optoelectronic Coupling in a 3C-SiC/Si Heterostructure for Self-Powered and Highly Sensitive Mechanical Sensing

Nguyen

Ninh

Nguyen

et al. 2023

ACS Appl. Mater. Interfaces

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This paper presents a novel self-powered mechanical sensing based on the vertical piezo-optoelectronic coupling in a 3C-SiC/Si heterojunction. The vertical piezo-optoelectronic coupling refers to the change of photogenerated voltage across the 3C-SiC/Si heterojunction upon application of mechanical stress or strain. The effect is elucidated under different photoexcitation conditions and under varying tensile and compressive strains. Experimental results show that the relationship between the vertical photovoltage and applied strain is highly linear, increasing under the tensile strain while decreasing under the compressive strain. The highest sensitivities to tensile and compressive strains are 0.146 and 0.058 μV/ppm/μW, respectively, which are about 220 and 360 times larger than those of the lateral piezo-optoelectronic coupling reported in literatures. These extremely large changes in vertical photovoltages are explained by the alteration in effective mass, energy band shift, and repopulation of photogenerated holes in out-of-plane, in-plane longitudinal, and in-plane transverse directions when strains are exerted on the heterojunction. The significant enhancement of strain sensitivity will pave the way for development of ultrasensitive and selfpowered mechanical sensors based on the proposed vertical piezo-optoelectronic coupling.

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“…Microscale MEMS devices can run independently or in conjunction with other hardware. MEMS devices can have a relatively straightforward construction with no movable parts or a highly sophisticated structure with numerous integrated moveable components [17][18][19] . Due to their cost-effective advantages over conventional devices, such as their small size, light weight, low power consumption, flexibility to create them in batches, superior performance, and more precise findings, MEMS devices have become increasingly popular.…”

Section: Introductionmentioning

confidence: 99%

A Review on Microchannel Fabrication Methods and Applications in Large-Scale and Prospective Industries

Afzal¹,

Tayyaba²,

Ashraf³

et al. 2022

Evergreen

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Microchannels based on microelectromechanical systems (MEMS) have received a lot of interest in the microfluidics and biomedical fields over the past forty years. While their applications have been multifarious, a comprehensive literature review focusing on their design, type, and applications is not currently present in the literature. Researchers working on these elements of microchannels will gain targeted knowledge from the current review on microchannels. Due to its advanced properties, flexibility of mass, and small size, microdevice demand has been rising quickly, particularly in industrial applications. The classification of microchannels and their uses are the main focus of this work. These include but are not limited to molding, electroplating, lithography, lab-ona-chip, micromolding, micromachining, micromilling, laser ablation, lithography, microcontact printing (µcp), hot embossing, electrochemical micromachining (EMM), and etching. In addition, numerous hybrid techniques for microchannel manufacturing have been reported. So, in essence, this review offers a range of advancements in microchannel manufacturing. The review also attempts to present a qualitative analysis describing the various methodologies associated with microchannels in terms of their design, shape, and flow regimes for applications such as pressure drop and transfer of heat prediction. Additionally, depending on the precise uses needed, a number of materials, including but not limited to ceramics, silicon, metals, and polymers, are utilized in the manufacture of microchannels. On metallic substrates, polymers such as silicon, glass, and polymeric materials are used. The biomedical industry uses polymeric and glass substrates instead of silicon substrates, which are used for mechanical engineering and electronic applications. In addition to outlining methods for choosing the best kind of microchannel, this paper also suggests important directions for the future.

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Design, fabrication and test of a bulk SiC MEMS accelerometer

Cited by 24 publications

References 17 publications

Spin-Acoustic Control of Silicon Vacancies in 4H Silicon Carbide

Spin-Acoustic Control of Silicon Vacancies in 4H Silicon Carbide

Vertical Piezo-Optoelectronic Coupling in a 3C-SiC/Si Heterostructure for Self-Powered and Highly Sensitive Mechanical Sensing

A Review on Microchannel Fabrication Methods and Applications in Large-Scale and Prospective Industries

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