2002
DOI: 10.1109/jmems.2002.805046
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Design, fabrication, and testing of an electrohydrodynamic ion-drag micropump

Abstract: This paper presents the design, fabrication, and testing of a novel electrohydrodynamic (EHD) ion-drag micropump. In order to maximize the electrical field gradients that are responsible for EHD pumping, we incorporated three-dimensional (3-D) triangular bumps of solder as part of the EHD electrodes. To form these bumps, Niobium was sputter-deposited onto a ceramic substrate, coated with photoresist, optically exposed and etched using a reactive ion etcher to define the electrode pattern. The substrate was the… Show more

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Cited by 123 publications
(48 citation statements)
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“…use ion drag as the force to drive the fluid. However, most of the micropumps in the literature referred to as being ion-drag pumps are injection-type EHD pumps (Darabi et al 2002, Seyed-Yagoobi 2005.…”
Section: Ion-dragmentioning
confidence: 99%
“…use ion drag as the force to drive the fluid. However, most of the micropumps in the literature referred to as being ion-drag pumps are injection-type EHD pumps (Darabi et al 2002, Seyed-Yagoobi 2005.…”
Section: Ion-dragmentioning
confidence: 99%
“…The new trend is to develop non-mechanical or moving-part-free micropumps by utilizing electrokinetic forces and surface tension (or surface energy-related forces) such as the electroosmotic (EO) effect [5], electrophoresis (EP) [6], dielectrophoresis (DEP) [7,8], asymmetric electric field, electrowetting-on-dielectrics (EWOD) [9,10], electrostatic pumps [11,12] etc. Electrokinetic force based micropumps typically require electric/magnetic fields to mobilize ionic, or polarisable particles and species in a liquid which can drag the liquid through friction forces to form a continuous flow.…”
Section: Acoustic Wave Based Microfluidicsmentioning
confidence: 99%
“…These advantages make them attractive for applications in micro cooling de-vices (6), (7) . Darabi et al (8) developed a series of planar comb finger electrodes which was three dimensional triangular bumps of solder. These electrodes were formed by the Niobium sputter-deposited on a ceramic substrate.…”
Section: Introductionmentioning
confidence: 99%